Page 46
www.us-tech.com
February, 2013 ViTrox Intros X-Ray Inspection System
Penang, Malaysia — ViTrox Technologies is high- lighting its V810 X-Ray inspection system with the new Phase Shift Profileometry — a patented technology for warpage compensation and 100 percent through-hole component PCBs. In addi- tion, to serve market demands for small scale component inspection, the V810 is now equipped with variable magnification at 11 and 19 microns to provide end users with better magnified im- ages and resolution on small components such as 01005s and 0.2mm CSPs. Winner of Global Technology and NPI
Awards, the V810 is the latest revolution in X-ray technology inspecting double-sided panels with high defect coverage, high inspection speed and an excellent call rate. The system is designed for in-
line and offline use and works on both lead and lead-free solder joints. The V810’s state-of-the-art technology is based on Digital Tomosynthesis
methodology and runs on a new platform with Windows 7 Professional 64bit. Also on display, the new generation V510 G2
Series AOI system offers greater performance for faster inspection with inspection speeds up to 55cm2/sec for post-reflow and 65cm2/sec for pre-re- flow. The system is designed for low power con- sumption with a brilliant LED monitor display and improved ergonomic adjustment to increase viewing comfort for sit or stand operation. The new multi-shot imaging technology en-
V-810 X-ray inspection system.
ables the system to capture up to 180 frames per second and the multi-core processing technology significantly enhances inspection time. In addi- tion, the monochrome color camera uses solid- state modeling technologies to enable best-in-class
color inspection. Contact: ViTrox USA, 1460 Koll
Circle, Suite A, San Jose, CA 95112 % 970-481-3663 fax: 408-573-1079
Finally, a Pb-free solder paste that takes a shine to ENIG/gold PC boards.
Introducing NC-560-LF, the Pb-free no-clean solder paste designed for hard-to-solder metallization surfaces
Nothing increases production yields like AMTECH’s NC-560-LF, the lead-free, no-clean solder paste for hard-to-solder metallization surfaces, including ENIG (Gold),OSP, HASL and immersion silver
boards.This fully RoHS-compliant solder paste delivers unparalleled lot-to-lot and stencil printing consistency, and enhanced solderability due to superior print performance characteristics, including excellent wetting and activity, ideal viscosity, long stencil life, thermal stability up to 300
o C, and minimal residue. NC-560-LF
solder paste is also low beading, low voiding, and anti-tombstoning to reduce scrap and rework. Looking to strike it rich with greater hourly throughput? CallAMTECH today, and you’ll be golden.
AMTECH
www.amtechsolder.com
FI LLI NG TH E VO ID See us at IPC/APEX Booth 3426
Web:
www.vitrox.com See at IPC/APEX Booth #2707.
Step Stencil Family from Photo Stencil
Colorado Springs, CO — Photo Stencil, LLC will be presenting its line of step stencils, which offer significant flexibil- ity in achieving the proper solder paste height and volume for the overall paste printing process. This is especially true when trying to print on boards contain- ing very small components or compo- nents of different heights. Step stencils are available in
laser-based, NicAlloy-XT, and elec- troformed formats with steps on the PCB side, squeegee side, or on both sides of the stencil. There are many types of step
stencils, including step-down and step-up stencils. Relief step-board side stencils eliminate the gap be- tween the stencil apertures and the pads, allowing the stencil to cleanly gasket to the PCB. Step stencils can be used for: step-up stencils for ce-
Stencil patterns for BGAs.
ramic BGAs; step-up stencils for in- trusive reflow; step stencils with a relief etch pocket on the contact side (board side); step stencils for two- print applications for mixed technol- ogy; thick stencils with etched reser- voir pockets for printing glue for a variety of components with different stand-off heights; two-print stencil, with etched relief pockets, for print- ing glue for component attachment after SMT solder paste has been printed; 3-D electroform stencils with a formed relief pocket for a high flex connector that connects two PCBs; two-print stencils for printing small devices like 0.3mm pitch µBGAs and 01005s at the same time as printing large devices like RF shields, SMT connectors, QFPs and
other chip components. Contact: Photo Stencil, 4725
Centennial Blvd., Colorado Springs, CO 80919 % 719-599-4305 Web:
www.photostencil.com
See at IPC/APEX Booth #1215.
Page 1 |
Page 2 |
Page 3 |
Page 4 |
Page 5 |
Page 6 |
Page 7 |
Page 8 |
Page 9 |
Page 10 |
Page 11 |
Page 12 |
Page 13 |
Page 14 |
Page 15 |
Page 16 |
Page 17 |
Page 18 |
Page 19 |
Page 20 |
Page 21 |
Page 22 |
Page 23 |
Page 24 |
Page 25 |
Page 26 |
Page 27 |
Page 28 |
Page 29 |
Page 30 |
Page 31 |
Page 32 |
Page 33 |
Page 34 |
Page 35 |
Page 36 |
Page 37 |
Page 38 |
Page 39 |
Page 40 |
Page 41 |
Page 42 |
Page 43 |
Page 44 |
Page 45 |
Page 46 |
Page 47 |
Page 48 |
Page 49 |
Page 50 |
Page 51 |
Page 52 |
Page 53 |
Page 54 |
Page 55 |
Page 56 |
Page 57 |
Page 58 |
Page 59 |
Page 60 |
Page 61 |
Page 62 |
Page 63 |
Page 64 |
Page 65 |
Page 66 |
Page 67 |
Page 68 |
Page 69 |
Page 70 |
Page 71 |
Page 72 |
Page 73 |
Page 74 |
Page 75 |
Page 76 |
Page 77 |
Page 78 |
Page 79 |
Page 80 |
Page 81 |
Page 82 |
Page 83 |
Page 84 |
Page 85 |
Page 86 |
Page 87 |
Page 88 |
Page 89 |
Page 90 |
Page 91 |
Page 92 |
Page 93 |
Page 94 |
Page 95 |
Page 96 |
Page 97 |
Page 98 |
Page 99 |
Page 100 |
Page 101 |
Page 102 |
Page 103 |
Page 104 |
Page 105 |
Page 106 |
Page 107 |
Page 108 |
Page 109 |
Page 110 |
Page 111 |
Page 112 |
Page 113 |
Page 114 |
Page 115 |
Page 116 |
Page 117 |
Page 118 |
Page 119 |
Page 120 |
Page 121 |
Page 122 |
Page 123 |
Page 124 |
Page 125 |
Page 126 |
Page 127 |
Page 128 |
Page 129 |
Page 130 |
Page 131 |
Page 132 |
Page 133 |
Page 134 |
Page 135 |
Page 136