Page 74
www.us-tech.com
February, 2013
Keeping Wave and Selective Soldering Up to Date
Continued from page 72
system works with heated Nitrogen. The 360° distribution system ensures even Nitrogen flow with minimal local pressure. Compared to a locally
inerted Nitrogen hood, N2 consump- tion is approximately 20 percent less and the dross generation is reduced to 10 percent. Based on these sav- ings, ROI for a new full tunnel machine can be within 12 to 24
AOI will automatically be transferred to the repair station.
Added Value The company works closely with
industry partners to bring added value to its customers. These are cus- tomer-specific projects, but also involve industry consortiums collabo- rating on a common approach to whole-line electronic equipment
Miller-Stephenson Offers a Wide Range of Speciality Chemicals
Flux Removers Solvent Cleaners Contact Cleaners
Connector Lubricants Conformal Coatings Aero-Duster®
Freeze Spray
PTFE Release Agents DuPont™ Krytox®
(Low Global Warming Formulations Available) over 50 years of Quality and Service
m s
California - Illinois - Connecticut - Canada 800.992.2424 203.743.4447
e-mail:
support@miller-stephenson.com www.miller-stephenson.com
See us at Electronics West/MDM Booth 1965 Lubricants
High pressure chamber integrated in the SEHO MaxiReflow for a void-free soldering process.
months. Thus this new concept and design allows the user to improve quality and save money.
Embedding AOI The company recently won an
award for the new automated optical inspection (AOI) system that can be embedded directly in the selective soldering process in the Power Selective system. We are planning to incorporate this process in other machine concepts. Because of special lighting technology used in this AOI system, we are able to see solder balls, non-wetting or insufficient wetting, bridging and missing pins on the bottom-side. Using the same axis for AOI as
for selective soldering, this AOI sys- tem becomes very affordable. Finding failures early in the production line can be used to adjust the selective sol- dering process. It also allows the user to separate all failed PCBs from the line ensuring 100 percent quality for the products leaving the selective sol- der process. Any product that fails the
assembly. In addition, we continu- ously support customers with our extensive process knowledge — offer- ing seminars at the SEHO Academy, as well as analysis and suggestions from the SEHO Global Process Team. By utilizing these resources, every company’s professional devel- opment staff can achieve added value and substantially reduce its produc- tion costs. Today’s trends in solder- ing call for increased levels of effi- ciency and technology. SEHO offers economical standard solutions as well as individual solutions for cus- tomers. This approach keeps the company and our customers abreast of market trends while allowing cus- tomers to participate in these changes as they occur. Contact: Seho North America,
Inc., 1420 Jamike Drive, Erlanger, KY 41018 %859-371-7346 fax: 859-282-6718 E-mail:
sehona@sehona.com Web:
www.sehona.com or
www.seho.de r
See at IPC/APEX Booth #409.
Future Dispensing and MID Technologies
Continued from page 71 l LDS circuits should be round-
ed rather than angled so that the laser can activate them with continu-
ous movement. l There is a 70° rule: a vertical
surface (90°) cannot be activated by the laser. But if a surface is at an angle of 70°, then the laser can selec- tively activate it without having to turn the work piece.
3-D Placement And Dispensing MID allows the application of
See us at Electronics West/MDM Booth 4081
circuits directly to housing parts, and as a result, MIDs are usually in 3-D. In 2011, Essemtec introduced Hydra, the first standard machine for the assembly of such products. It is a combination of a Paraquda pick-and- place with a 6-axis robot. Hydra dis- penses glue and paste and it places components at almost any angle.
Despite the complex process, the machine’s operation is as simple as with a 2-D pick-and-place machine. Hydra places all types of SMD
components. In 3-D mode, the 4-nozzle pick-and-place head can place up to 2,500 components per hour. In 2-D mode the placement rate can reach up to 7,000 cph. The machine can be installed in a production line and, because of its flexibility, changeover between products can be done very quickly. Because of its design, There - fore, Hydra can assemble prototypes as well as significant production runs. Contact: Essemtec USA, 816
N. Delsea Drive, #308, Glassboro, NJ 08028 % 856-218-1131 fax: 856-218-1134 E-mail:
sales@essemtec-usa.com Web:
www.essemtec-usa.com r
See at IPC/APEX Booth #3233.
Visit Us At MD&M BOOTH #1965
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