February, 2013
www.us-tech.com
Teledyne LeCroy Announces Power Analyzer Software Option
Chestnut Ridge, NY — Teledyne LeCroy has intro- duced its Power Analyzer software option for the HDO4000 and HDO6000 high definition oscillo- scopes, which enables easy measurement and pow- erful analysis of the operating characteristics of power conversion devices and circuits. With the software, the HDO oscilloscopes analyze all as- pects of switched-mode power devices with tools for automatic power loss measurements, control loop modulation analysis, and line power harmon- ics testing, all within a streamlined user interface that simplifies probe and measurement setup. For analysis of power losses in switching de-
vices or circuits, the Power Analyzer software au- tomatically detects and measures turn-on, turn- off, conduction, and off-state losses. A unique color-coded overlay anno- tates the power waveform and iden- tifies all areas of power losses. The Safe Operating Area (SOA) plot shows in-circuit behavior of the power device under test to quickly identify any transitions near the peak power limits. The dedicated in- terface handles proper probe setup to eliminate sources of error associated with probing. Control loop analysis evaluates the loop dynamics of switched-mode
ASSET Intros IJTAG Board Test Instru- ments
Richardson, TX — Two new instru- ments for ASSET® InterTech’s Scan- Works® platform for embedded in- struments provide an FPGA-con- trolled test (FCT) toolkit, said to be the first to automatically insert mul- tiple instruments into an FPGA, con- figure and connect the instruments as a cohesive board-tester-in-a-chip, and operate the tester from an intu- itive drag-and-drop interface.
Screen Prin
power devices, plotting the variation of pulse width, duty cycle, period, or frequency. This analy-
sis mode takes advantage of the HDO’s long mem- ory of up to 250 Mpts to capture control loop per- formance during startup. Pre-compliance testing of line power harmon-
ics is performed to the EN61000-3-2 standard. Voltage, current, and line harmonics may be viewed simultaneously. Mask testing reports when harmonics are outside the allowable range and all
results are then summarized in a table. Contact: Teledyne LeCroy Corp.,
700 Chestnut Ridge Road, Chestnut Ridge, NY 10977-6499 % 800-553-2769 or 845-425-2000 fax: 845-578-5985 Web:
www.teledynelecroy.com
Oscilloscopes get power analyzer software option.
See at Electronics West/MD&M Booth #1795.
Page 25
Complete Line Solutions from
Wave Solder Machines
FCT tester coverage. The two embedded instruments
involve testing on-board memory. One is a DDR2/DDR3 memory link tester and the second instrument is a generic memory test instrument. Both of them test memory buses from the inside out, eliminating the need for expensive probe-based ex- ternal instruments and testers. The FPGA host of ScanWorks
FCT does not need to be dedicated to test. FCT can be inserted in a func- tional FPGA and removed when it is no longer needed. For example, a ScanWorks FCT board tester might be inserted in an FPGA, used to bring up early prototypes and then removed. Later, it might be inserted and removed again during volume
manufacturing or field service. Contact: Asset InterTech, 2201
N. Central Expy., Ste 105, Richard- son, TX 75080 % 888-694-6250 or 972-437-2800 fax: 972-437-2826 Web:
www.asset-intertech.com
Same High Quality and Reliability Same Great Service and Support Same Three-Year Full Parts Warranty
Call Juki today and let us supply all of your SMT manufacturing needs.
Global Headquarters Tokyo, Japan Tel: (+81) 3 3480 1111 Email:
inqsmt@juki.co.jp
American Headquarters Morrisville, NC, U.S.A. Tel: (+1) 919 460 0111 Email:
sales@jas-smt.com
European Headquarters Solothurn, Switzerland Tel: (+41) 32 626 29 29 Email:
info-europe@jas-smt.com www.jukiamericas.com
Ovens
See us at IPC/APEX Booth 513
Page 1 |
Page 2 |
Page 3 |
Page 4 |
Page 5 |
Page 6 |
Page 7 |
Page 8 |
Page 9 |
Page 10 |
Page 11 |
Page 12 |
Page 13 |
Page 14 |
Page 15 |
Page 16 |
Page 17 |
Page 18 |
Page 19 |
Page 20 |
Page 21 |
Page 22 |
Page 23 |
Page 24 |
Page 25 |
Page 26 |
Page 27 |
Page 28 |
Page 29 |
Page 30 |
Page 31 |
Page 32 |
Page 33 |
Page 34 |
Page 35 |
Page 36 |
Page 37 |
Page 38 |
Page 39 |
Page 40 |
Page 41 |
Page 42 |
Page 43 |
Page 44 |
Page 45 |
Page 46 |
Page 47 |
Page 48 |
Page 49 |
Page 50 |
Page 51 |
Page 52 |
Page 53 |
Page 54 |
Page 55 |
Page 56 |
Page 57 |
Page 58 |
Page 59 |
Page 60 |
Page 61 |
Page 62 |
Page 63 |
Page 64 |
Page 65 |
Page 66 |
Page 67 |
Page 68 |
Page 69 |
Page 70 |
Page 71 |
Page 72 |
Page 73 |
Page 74 |
Page 75 |
Page 76 |
Page 77 |
Page 78 |
Page 79 |
Page 80 |
Page 81 |
Page 82 |
Page 83 |
Page 84 |
Page 85 |
Page 86 |
Page 87 |
Page 88 |
Page 89 |
Page 90 |
Page 91 |
Page 92 |
Page 93 |
Page 94 |
Page 95 |
Page 96 |
Page 97 |
Page 98 |
Page 99 |
Page 100 |
Page 101 |
Page 102 |
Page 103 |
Page 104 |
Page 105 |
Page 106 |
Page 107 |
Page 108 |
Page 109 |
Page 110 |
Page 111 |
Page 112 |
Page 113 |
Page 114 |
Page 115 |
Page 116 |
Page 117 |
Page 118 |
Page 119 |
Page 120 |
Page 121 |
Page 122 |
Page 123 |
Page 124 |
Page 125 |
Page 126 |
Page 127 |
Page 128 |
Page 129 |
Page 130 |
Page 131 |
Page 132 |
Page 133 |
Page 134 |
Page 135 |
Page 136