February, 2013
www.us-tech.com
Page 87 Seika: Dry Cabinets, Testers, and Storage Cases
Torrance, CA — Seika Machinery, Inc., is showcaseing its McDry PCB
requiring ultra-low humidity levels. In addition, the cabinets conform to IPC-1601 and IPC J-STD 033C guidelines for proper storage and handling of PCBs and moisture-sen- sitive components. Also on display, Sayaka’s
Sayaka’s CT23Q stress-free depanelizer.
Storage Cabinet and McDry MB-301 Low Temperature Baking Cabinet. McDry units come in 1 and 3 percent RH models to comply with the strict standards required for proper stor- age of moisture-sensitive materials
Qualitek: No-Clean Lead-Free Solder Paste
Addison, IL — Qualitek’s DSP 825HF solder paste is a no-clean, lead-free, halogen-free solder paste formulation with exceptionally high activity for improved solderability. The paste reportedly provides opti- mized reflow yield for lead-free pro-
CT23Q Series offers the solution for stress-free depanelization, providing a fixture-based highly efficient dust vacuum system. The router provides clean and precise depanelization for densely populated PCBs, and offline image-processing software for pro- gramming router paths. In addition, the CT56NJ Large Board Size Router will be displayed and the new Twin-Table model will be introduced
for the first time. The HIOKI 1240 Flying Probe
Tester provides a variety of benefits over conventional testing machinery. Some of these benefits include jig-less inspection for quick setup, and the proficient testing of mis-mounted components, faulty components, and poor contacts. Through resistance testing, the flying probe test is able to assess solder joints promptly, while avoiding possible board damage by using the soft-landing feature. The unit has a four-wire measurement function and capabilities extend to active in-circuit test of FETs, relays, and three-terminal voltage regulators — applications that are ordinarily
challenging test issues for convention- al equipment. The Sawa Mounter Nozzle Cleaner cleans 20 nozzles at a time. With the system, ultrasonically- vibrated water thoroughly passes through every nozzle opening. Double-cleaning power is generated with ultrasonic-energy cleaning and simultaneous vacuum suction. Nozzle tips and apertures can be cleaned
without leaving any residue. Contact: Seika Machinery, Inc.,
3528 Torrance Blvd., Suite 100, Torrance, CA 90503 % 310-540-7310 fax: 310-540-7930 E-mail:
info@seikausa.com Web:
www.seikausa.com
See at IPC/APEX Booth #2727.
No-clean solder paste.
cessing, with excellent print consis- tency with high process yield index across multiple board designs. The paste makes possible high
print speeds up to 150mm/sec (6- in./sec). Joints are left shiny and bright after reflow, enhancing the appearance. Medium soft non-crack- ing residues are pin-testable, non- conductive, non-corrosive and highly insulated. Flux classification ROL0 per JSTD-004. Available in SAC 305 and SAC 405 alloys with type 3 pow- der type 4 available upon special request. The paste is compatible with air or Nitrogen reflow, while best results are achieved in a forced air convection oven with a minimum of 8 zones (top and bottom). It may also be reflowed with 4-zone oven (top and bottom). The paste is avail- able in 250, 500 gram jars, or 500
gram Semco Cartridge. Contact: Qualitek International,
Inc. 315 Fairbank St., Addison, IL 6010 % 630-628-8083 fax: 630-628- 6543 E-mail:
dliguori@qualitek.com Web:
www.qualitek.com
See at IPC/APEX Booth #1237. See us at IPC/APEX Booth 1417
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