February, 2013
www.us-tech.com
Page 39 Techspray: Eco-Friendly Cleaners
Amarillo, TX — Techspray’s full line of water-based cleaners for electronic assembly expand the company be- yond its traditional solvent products. Eco-dFluxer SMT100 (part
#1550) is a water-based, environmen- tally friendly cleaner that is designed to work in both inline and batch cleaning equipment. An optimal com- bination of solvents and saponifiers lowers surface tension for penetra- tion under low stand-offs, and power- ful cleaning action to remove all flux residues. Effective on a wide variety of solders and fluxes: lead, lead-free, aqueous, RMA, no-clean, and new halide-free fluxes. The cleaner is highly compatible with common PCB metals and plastics. Eco-Stencil RF (part #1571) is
an effective non-flammable drop-in replacement for isopropyl alcohol (IPA) and other solvents commonly used in rinse-free batch stencil clean- ing systems. This special solvent and DI water blend is effective at remov- ing a wide variety of pastes and ad- hesives. It can also be used as manu- al and under-stencil cleaners. When a water rinse is a part of
the cleaning process, Eco-Stencil AQ (part #1572) provides an eco- nomical, yet powerful cleaning solu- tion. This water-based cleaner uses the latest environmentally friendly surfactants to break down pastes
Automatic Profiling
Complements AOI & X-ray Inspection
Continued from previous page
There are several other problematic aspects of the thermal process exac- erbated by the tiny components. Gen- erally, the acceptable thermal process window shrinks, sometimes significantly, making it much more difficult to reflow these new compo- nents. Special care needs to be taken during the setup of the reflow oven for such assemblies in order to find that narrow “sweet spot” in the process. During production, there al-
ways will be a certain amount of drift in the thermal process. With more narrow tolerances, the process needs to be optimized during setup while more frequent profiling must be im- plemented to verify that all these components continue to be produced in spec.
The good news is that there is a
growing, developing body of knowl- edge about these issues. Some of the solder paste manufacturers, for ex- ample, have produced excellent and helpful papers on issues such as void- ing and graping. In addition, auto- matic profiling systems have become more intelligent and affordable. They help to verify that the production of the new, smaller components is made correctly, while complementing the existing AOI and X-ray inspection. Contact: KIC, 16120
W. Bernardo Dr., San Diego, CA 92127 % 858-673-6050 fax: 858-673-0085
Web:
www.kicthermal.com See at IPC/APEX Booth #1314.
Experience Panasonic’s amazing new solutions for any-mix manufacturing in booth 927 at APEX.
No matter if you’re high mix/low volume, low mix/high volume or anything in between, Panasonic equipment, MES software, and other services can help improve throughput and effi ciency while keeping quality reliably high.
panasonicfa.com © 2013 Panasonic Corporation of North America. All rights reserved. See us at IPC/APEX Booth 927
and adhesives. Its highly concen- trated formula saves shipping and storage cost.
Eco-Stencil UM (part #1570) is
a non-flammable cleaner for manual- ly wiping stencils and tools, and for under-stencil cleaning. It is a safer and more environmentally friendly alternative to IPA. It has been tested and certified for under-stencil clean- ing in Speedline MPM printers. Contact: Techspray, P.O. Box
949, Amarillo, TX 79105 % 800-858-4043 fax: 806-372-8750
E-mail:
tsales@techspray.com E-mail:
kpawlowski@techspray.com Web:
www.techspray.com
Eco-dFluxer SMT 100. See at IPC/APEX Booth #3201.
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