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news digest ♦ Equipment and Materials


The CPV Market following the acquisition of Quantasol technology - Jan-Gustav Werthen, JDSU, Senior Director


Commercialisation of GaN on SI based Power Devices at International Rectifier- Dr. Michael A. Briere, International Rectifier


GaN the enabler for true SDR- Professor Rik Jos, RF Technology Fellow & Innovation Manager, NXP Semiconductors


Holistic Approach to MOCVD vacuum & Abatement- Dr Mike Czerniak, Product Marketing Manager, EdwardsVacuum Ltd


Advances in Wide Bandgap Semiconductors for Power Electronics- Dr. Markus Behet, Global market manager, Power Electronics, Dow Corning


Large diameter GaN-on-Si epiwafers for power electronics- Dr Mariane Germain, Co- Founder & CEO, EpiGaN


Achieveing Gan & GaAs RF Design Success through Product & Foundry Innovation– Mr Bryan Bothwell, Strategy and Business Development Manager – Foundry Services, TriQuint Semiconductor


Damage - free Deposition on LED devices- Dr Silvia Schwyn Thöny, Senior Process Engineer, Evatec Ltd


Temporary Bonding: An enabling technology for RF and power compound semiconductor devices - Dr Thomas Uhrmann, Business Development Manager, EV Group (EVG)


Brewer and SUSS to commercialise ZoneBOND process


The joint effort combines both companies’ 230 www.compoundsemiconductor.net January / February 2012


expertise to provide a complete material, equipment and process solution, optimised for each individual customer’s process needs in thin wafer handling.


Brewer Science, the inventor of ZoneBOND technology and expert in materials and processes for thin wafer handling, and SUSS MicroTec are joining forces in commercialising ZoneBOND technology for thin wafer handling.


SUSS MicroTec is now offering the Brewer Science ZoneBOND process on the XBC300 and XBS300 platforms, targeted for high volume bonding and debonding of 200/300mm wafers using silicon or glass carriers.


Brewer Science offers products specifically designed for the successful implementation of its ZoneBOND process including materials for carrier preparation, adhesives, removers, as well as small scale debonding equipment.


ZoneBOND technology is an innovative solution for wafer handling that provides excellent total thickness variation (TTV) control, high- temperature stability, and low-stress debonding. Customers will benefit through higher yield at debonding, higher throughput, and lower cost of ownership.


This joint effort combines both companies’ expertise to provide a complete material, equipment and process solution, optimized for each individual customer’s process needs.


Brewer Science is a global technology leader in creating, developing, and manufacturing specialty materials, equipment, and process solutions for applications in semiconductors, advanced packaging/3-D ICs, MEMS, sensors, displays, LEDs, and printed electronics. The company’s 30 years of in-depth knowledge and expertise in materials science, chemistry, physics, optics, modelling, and process integration distinguish it from all other material suppliers worldwide.


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