news digest ♦ Lasers
more than 25 million Fabry-Perot (FP) and DFB lasers in high-growth markets such as EPON (Ethernet Passive Optical Network) and GPON (Gigabit Passive Optical Network).
“The current funding will enable BinOptics to leverage its patented laser structures and manufacturing processes to move into new materials and markets,” said Gefinor Ventures’ Chris Davis.
BinOptics, a supplier of compound semiconductor lasers current products include a wide range of FP and DFB lasers as well as lasers with integrated monitoring photodiodes. With modulation speeds up to 10 Gbps, these products provide transceiver and other photonic equipment manufacturers with unprecedented price-performance advantages.
BinOptics also provides custom integrated components for optical systems and subsystems. These solutions deliver exceptional value through cost, size, and power reductions by replacing several discrete components with a monolithic chip.
InP fibre-coupled diode laser for minimally invasive therapy
Laser Operations’ 200W 1470nm indium phosphide laser has double the output power of the original laser of this kind launched in 2009
Recent developments in performance of InP semiconductor materials and beam combination optics pioneered by Laser Operations LLC have enabled a new milestone for “eyesafe” fibre-coupled laser module performance.
The Ultra-500 QPC Lasers fibre-coupled module now produces 200W CW from a standard detachable 550µm core fibre at a wavelength of 1470nm. This achievement
152
www.compoundsemiconductor.net January / February 2012
represents a doubling of output power since the launch of the first laser of this kind in 2009), in the same Ultra-500 conduction-cooled rugged package.
The increased power will enhance ablation rate and efficient blood coagulation for applications such as Benign Prostate Hyperplesia and ENT surgery where “eyesafe” wavelengths have already demonstrated superior clinical results.
The small laptop-size and low power consumption of the conduction-cooled Ultra-500 diode laser module (>25% conversion efficiency) enables a 3X to 5X reduction in size and cost of ownership versus incumbent laser technologies which are based on power hungry, high maintenance and bulky DPSS or flashlamp-based laser platforms.
The OEM module is equipped with redundant fibre sensors and monitor photodiodes, visible aiming beam, field-replaceable blast shield, integrated cooling plate and thermistor for “plug and play” system integration.
Jenoptik’s Berlin plant for high-power semiconductor lasers
The investment for the expansion is in total approximately € 10 million. This will more than double the production capacities of gallium arsenide based lasers from 2013.
Jenoptik laid the foundation stone for the expansion of the semiconductor production in a
Page 1 |
Page 2 |
Page 3 |
Page 4 |
Page 5 |
Page 6 |
Page 7 |
Page 8 |
Page 9 |
Page 10 |
Page 11 |
Page 12 |
Page 13 |
Page 14 |
Page 15 |
Page 16 |
Page 17 |
Page 18 |
Page 19 |
Page 20 |
Page 21 |
Page 22 |
Page 23 |
Page 24 |
Page 25 |
Page 26 |
Page 27 |
Page 28 |
Page 29 |
Page 30 |
Page 31 |
Page 32 |
Page 33 |
Page 34 |
Page 35 |
Page 36 |
Page 37 |
Page 38 |
Page 39 |
Page 40 |
Page 41 |
Page 42 |
Page 43 |
Page 44 |
Page 45 |
Page 46 |
Page 47 |
Page 48 |
Page 49 |
Page 50 |
Page 51 |
Page 52 |
Page 53 |
Page 54 |
Page 55 |
Page 56 |
Page 57 |
Page 58 |
Page 59 |
Page 60 |
Page 61 |
Page 62 |
Page 63 |
Page 64 |
Page 65 |
Page 66 |
Page 67 |
Page 68 |
Page 69 |
Page 70 |
Page 71 |
Page 72 |
Page 73 |
Page 74 |
Page 75 |
Page 76 |
Page 77 |
Page 78 |
Page 79 |
Page 80 |
Page 81 |
Page 82 |
Page 83 |
Page 84 |
Page 85 |
Page 86 |
Page 87 |
Page 88 |
Page 89 |
Page 90 |
Page 91 |
Page 92 |
Page 93 |
Page 94 |
Page 95 |
Page 96 |
Page 97 |
Page 98 |
Page 99 |
Page 100 |
Page 101 |
Page 102 |
Page 103 |
Page 104 |
Page 105 |
Page 106 |
Page 107 |
Page 108 |
Page 109 |
Page 110 |
Page 111 |
Page 112 |
Page 113 |
Page 114 |
Page 115 |
Page 116 |
Page 117 |
Page 118 |
Page 119 |
Page 120 |
Page 121 |
Page 122 |
Page 123 |
Page 124 |
Page 125 |
Page 126 |
Page 127 |
Page 128 |
Page 129 |
Page 130 |
Page 131 |
Page 132 |
Page 133 |
Page 134 |
Page 135 |
Page 136 |
Page 137 |
Page 138 |
Page 139 |
Page 140 |
Page 141 |
Page 142 |
Page 143 |
Page 144 |
Page 145 |
Page 146 |
Page 147 |
Page 148 |
Page 149 |
Page 150 |
Page 151 |
Page 152 |
Page 153 |
Page 154 |
Page 155 |
Page 156 |
Page 157 |
Page 158 |
Page 159 |
Page 160 |
Page 161 |
Page 162 |
Page 163 |
Page 164 |
Page 165 |
Page 166 |
Page 167 |
Page 168 |
Page 169 |
Page 170 |
Page 171 |
Page 172 |
Page 173 |
Page 174 |
Page 175 |
Page 176 |
Page 177 |
Page 178 |
Page 179 |
Page 180 |
Page 181 |
Page 182 |
Page 183 |
Page 184 |
Page 185 |
Page 186 |
Page 187 |
Page 188 |
Page 189 |
Page 190 |
Page 191 |
Page 192 |
Page 193 |
Page 194 |
Page 195 |
Page 196 |
Page 197 |
Page 198 |
Page 199 |
Page 200 |
Page 201 |
Page 202 |
Page 203 |
Page 204 |
Page 205 |
Page 206 |
Page 207 |
Page 208 |
Page 209 |
Page 210 |
Page 211 |
Page 212 |
Page 213 |
Page 214 |
Page 215 |
Page 216 |
Page 217 |
Page 218 |
Page 219 |
Page 220 |
Page 221 |
Page 222 |
Page 223 |
Page 224 |
Page 225 |
Page 226 |
Page 227 |
Page 228 |
Page 229 |
Page 230 |
Page 231 |
Page 232 |
Page 233 |
Page 234 |
Page 235 |
Page 236 |
Page 237 |
Page 238 |
Page 239 |
Page 240 |
Page 241