May, 2021
www.us-tech.com
DULUTH, GA — Koh Young Technology is exhibiting a full suite of inspection and process control solutions at NEPCON China 2021, including 3D SPI, 3D AOI, 3D inspection for micro-thin solder paste, advanced packaging inspection, dispensing inspection, automated pin inspec tion, and its KSMART smart factory platform. Koh Young’s KY8030-3 3D
SPI system offers automatic paste dispensing with its “auto- rework” option, eliminating cost- ly mistakes due to insufficient solder causing open joints, lean
Systems ROSWELL, GA — Rehm is show- casing several systems from its portfolio of convection, vapor phase soldering, and contact sol- dering machines, as well as fur- ther developments in plant and process technology, at NEPCON China 2021. Highlights of Rehm’s Vision
series convection soldering sys- tems include the VisionXP+ Vac’s EC fan motors, which make the system quiet and more sustainable. They also make it more stable and simplify temper- ature profiling. Each zone can be heated as well as cooled. A new chamber design and a
newly developed cooling section also contribute to the sustain- ability of the factory, and the modular and adaptive residue management system (MARS) provides optimal collection and separation of residues. The CondensoXS has a new
chamber design that opens and closes vertically, ensuring opti- mal hermetic sealing and flexible integration into existing or new production lines. Rehm’s Protecto series for dis-
pensing and coating offers flexible material application options, depending on requirements. With the help of the ViCON Protecto system software, there are only a few steps between assembly lay- out and final coating. The Nexus contact vacuum
soldering system has also been upgraded. An integrated bubbler system dopes with formic acid and is installed near the process. Components remain fixed in position during the entire solder-
ing process. Contact: Rehm Thermal
Systems, LLC, 3080 Northfield Place, Suite 109, Roswell, GA 30076 % 770-442-8913 E-mail:
c.kramer@rehm-
group.com Web:
www.rehm-
group.com
See at NEPCON China, Booth 1G40
Worldwide Headquarters Vista, California, USA. +1 (760) 438-1138
sales@visionpro.com
Rehm Shows Selection of Soldering
fillets and weak joints. Also, its Review 3.0 feature provides intu- itive verification. The Zenith F 3D AOI system
is a solution for high-volume FPCB inspection. Due to the thin and pliable nature of the flexible PCBs, special handling is required. This system also bases its inspection results on IPC-610 criteria, using true-3D inspec- tion for hotbar soldering. Koh Young’s Zenith Alpha is
the company’s best value 3D AOI solution. Koh Young Auto Programming (KAP) simplifies the programming process to minimize both time and cost. Also, “whole- board foreign material inspection” (WFMI) combines 2D and true-3D
inspection to identify foreign material, such as burr, solder balls, chips, and other debris that may lead to costly field failures. Also on display at the exhibi- tion are the Meister S and Meister
Page 75 Koh Young Exhibits True-3D Inspection Systems
D inspection systems for micro- thin solder paste and advanced packaging, respectively, as well as the Neptune C+ dispensing process inspection (DPI) system, KY-P3 3D automated pin inspec- tion system, and Koh Young’s smart factory platform, KSMART, which automates process control, while focusing on data manage-
ment, analysis and optimization. Contact: Koh Young America, Inc., 1950 Evergreen Boulevard,
Suite 200, Duluth, GA 30096 % 704-651-2860 E-mail:
brent.fischthal@
kohyoung.com Web:
www.kohyoung.com
Zenith F 3D AOI system.
See at NEPCON China, Booth 1H15
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