May, 2021
www.us-tech.com
Page 63
From A to Z: Next-Gen AOI with Advanced Z-Axis Control Continued from page 58
out the process, reflow soldering often induces warpage in PCB assemblies. Any type of assembly can be vulnerable, including stan- dard multilayer PCBs as well as multipanel boards with perfora- tions or gaps, large boards, and flexible substrates. Accurate focusing of the AOI system is typ- ically achieved by applying a cor- rection factor based on laser height measurements. Alternatively, one or more
push-up pins may be positioned beneath the board to restore coplanarity of the board. Either approach introduces additional subsystems that add complexity to the inspection equipment and place extra demands on opera- tors. Care is required when posi- tioning push-up pins to identify the most effective location that avoids contact with vulnerable components or interconnects on the underside of the board. To increase productivity, manufac- turers need warpage correction that effectively minimizes opera- tor intervention.
AOI in the Z-Axis By enhancing the z-axis con-
trol in the AOI system to extend the working distance, both the effective depth of field in 2D inspection and height-measure- ment capability in 3D mode can be increased. With such enhance- ments, innovative new AOI fea- tures become possible that permit fast and accurate inspection of tall components and press-fit pins, excessively warped boards, and PCBs in jigs, with minimal opera- tor involvement.
Expanding AOI into the z-axis enables greater flexibility for boards
with tall components or PCB-on-PCB assemblies.
Typical AOI systems have
insufficient depth of field to focus on identification and polarity markings on tall components, as well as low-profile components using OCR. An extended work- ing distance allows the system to refocus on tall components and combine the two fields of view to create a sharply focused compos- ite image. Similarly, taking advantage of extended z-height adjustment allows AOI in manu- facturing to benefit from greater depth of field when inspecting PCBs mounted in jigs. With this extra flexibility
engineered into the system, AOI can offer new capabilities that enhance inspection of not only regular PCBs, but also boards containing tall components or PCB-on-PCB assemblies. Saki’s extended z-axis capa- bility of the 3Di-LS2 AOI system
now offers extended working height that effectively doubles the maximum height-measure- ment range in 3D mode, which is increased from the typical indus- try benchmark of 0.8 to 1.6 in. (20 to 40 mm). The maximum focus height in 2D is also increased to 1.6 in. (40 mm). In addition to allowing image
refocusing for OCR and focus adjustment for PCBAs in jigs, this enhancement allows further important new features including extended height reconstruction. Extended height reconstruction overcomes the challenges present- ed by tall press-fit pins. The full
height of pins over 0.8 in. (20 mm) can be measured to capture clear 3D images and accurate height measurements to help identify any defects.
Enhanced flexibility in the
z-axis, with precision control and new inspection algorithms, enhance 2D image capture and 3D height measurement to per- mit important new features, such as focus adjustment modes that facilitate inspection and simplify set up. Today, more than ever
before, electronic manufacturers are constantly under pressure to improve productivity, while main-
taining the highest levels of qual- ity assurance. AOI solutions, such as those
offered by Saki, are essential to achieve the high throughput and repeatable performance the in - dus try de mands and to capture and store reliable data for analy- sis and traceability. Contact: Saki America, Inc.,
48016 Fremont Boulevard, Fremont, CA 94538 % 510-623-7254 E-mail:
sales.us@
sakicorp.com Web:
www.sakicorp.com r
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ls s VJ Electronix 19 Alpha Rd. Chelmsford, MA 01824-4124
www.vjelectronix.com Email:
electronixsales@vjt.com
Tel: +1 631 589 8800
Bohemia, NY • Suzhou, China • Hartzviller, France • Budapest, Hungary • Bengaluru, India 4:08 PM
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