May, 2021
www.us-tech.com
Page 27 Europlacer Unveils New Placement Modules
POOLE, DORSET, UK — Europlacer has un- veiled the newest additions to its atom range of surface mount pick-and-place systems. The company launched the systems at pro- ductronica China 2021. Both new modules are designed to
integrate seamlessly with other Euro- placer platforms and boost placement productivity. The versatile ii-A1 is an ultra-flexible module with a single Tor- nado turret head. It can be deployed for specific SMT assembly duties or as a fully featured module, offering place- ment speeds up to 15,000 cph and the flexibility to handle devices up to 3.4 x 3.4 in. (99 x 99 mm) in size. Equipped with a pair of high-speed Pulsar pipette heads, the new ii-
KOKI Intros Solder Paste for Low-Temp
Reflow LAKE ELSINORE, CA — KOKI has released new solder pastes for low-temperature reflow sol- dering processes, designed for printing and dispensing applica- tions. For the benefits of reduc- ing power consumption and im- proving electrical reliability of assemblies, there has been de- mand for a low-melting tempera- ture solder paste for some time. Several Sn-Bi based alloy
products are already out and available in the market. Conven- tional Sn-Bi solder pastes often contain large amounts of rela- tively strong activator to secure meltability and coagulation equivalent to that of SAC305. If the heat applied is not sufficient and leaves the activator as residue, the residue could pose a reliability concern. Even if the solder paste is designed so that the solvent will evaporate easily for better insulation resistance, it has a trade-off as the solder paste may dry up too fast, nega- tively affecting the paste print- ing, viscosity and tackiness. The newly introduced solder
pastes T4AB58-HF360 for print- ing and T4AB58-HF360D for dis- pensing adopt an optimized amount of a carefully selected ac- tivator that effectively facilitates the reduction-oxidation reaction, thereby minimizing the amount of the added flux activator while securing excellent meltability and coagulation. This not only improves the insulation resist- ance, but also helps to achieve stability in continual application and in holding and securing com- ponents in place during and after
component placement. Contact: Koki Solder Ameri-
ca, Inc., 18510 Pasadena Av- enue, Suite E, Lake Elsinore, CA 92530 % 951-245-8755 E-mail:
roberto@kokiamerica.com Web:
www.kokiamerica.com
3D SPI 3D AOI 3D AXI 3D MXI 3D Bond CCI See at NEPCON China, Booth 1J20
www.viscom.com Innovation is in ou
nnovation is in our DNA:r Futur yy-ready inline X-ray i
Future-ready inline X-ray inspection of power electronics for EV
A2 module is designed as a chip shooter to take on workload duties from other Europlac- er machines in the line, offering placement speeds up to 50,000 cph for devices down to 01005 (0402 metric) in size.
With the same robust chassis, the two
systems offer Europlacer’s patented intelli- gent conveyor with board stops under full software control and can handle boards greater than 39.4 in. (1,000 mm) in length despite the compact module format. Both are compatible with a broad range of options, including all Euro- placer intelligent feeder technologies, which are available across all Euro-
placer placement platforms. Contact: Blakell Europlacer, 30 Factory Road, Upton Industrial Estate,
ii-A1 and ii-A2 placement systems.
Poole, Dorset, BH16 5SL, UK % +44-0-1202-266500 E-mail:
andy.jones@
europlacer.co.uk Web:
www.europlacer.com
Large, heavy, and solid assemblies – encased or as complete
models – require a 100% quality assurance. As a result, perfect-fit inline X-ray inspection in 2D, 2.5D, or 3D is the first choice for high current and high voltage electronics. With its iX7059 Heavy Duty Inspection solution, Viscom is setting a new standard for fast, high-
precision inline X-ray inspection. The special transport system enables seamless handling of inspection objects on workpiece carriers or in soldering frames with a weight of up to 40 kg – a unique feature that offers huge advantages for trending segments such as e-mobility, new energies, and telecommunications.
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