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www.us-tech.com
May, 2021
The Benefits of Dispensing Thermal Interface Materials
By Tim Meyer, Systems Design Engineer, PVA
tion continue to grow more important in the manufacturing industry. A variety of methods exist for aiding this heat trans- fer, of which gap filling pads, adhesive tapes and dispensable gels are the most common. The primary considerations when
A
selecting a TIM material are thermal conductivity and dielectric strength. However, there are several factors to con- sider when creating an efficient assembly process while still achieving optimal product performance. These include assembly tolerance, compression force, cycle time, waste generation, and equip- ment maintenance.
Dispensable Materials Dispensable gels, thermal pads and
tapes all provide a variety of thermal properties but differ significantly in application techniques and mechanical performance. Pads and tapes are cut from flat sheets of raw material. Applying shapes other than square or rectangular patterns to
Precision dispensing is key to applying optimal thermally dissipative materials.
make it difficult to achieve a TIM bond between components of differing height. Stacked tolerances inside an electronic
BE COOLER. STAY MAPI!
s powerful electronics shrink in size and increase in variety, thermal inter- face materials (TIMs) for heat dissipa-
a design often results in waste from the cut- ting or stamping process. Pads cut with uniform thickness can
assembly can create issues with creating con- tact of the pads or, in the other extreme, excess compression on sensitive electronics. Dispensable gels offer more flexibil-
ity in design geometry and tolerancing. A gel will give and flow into cavities, while still retaining enough body to hold shape and maintain contact with critical com- ponents. A precut pad, when com- pressed, can cause continuous stress. The nature of dispensing allows for
complex geometries to be applied. Multiple layers of material may also be applied in varying heights for a single TIM section without creating excessive waste. An automated dispensing solu- tion simplifies the application of TIM by eliminating the stamping or cutting process entirely. A variety of options are available for
dispensable materials besides the obvi- ous diversity in dielectric strength and thermal conductivity. Differences in vis- cosity, filler density, filler particle, cur- ing mechanism, and chemistry all pro-
vide for different applications. Pre-cured, single component moisture or
Continued on page 64
The WE-MAPI is one of the world’s smallest metal alloy power induc- tors. Its effi ciency is outstanding and now available in new sizes and extended temperature versions with AEC-Q200 Grade 0 qualifi cation for -55° to +150 °C operating temperature in the 4020HT series. Available from stock. Samples free of charge.
For further information please visit:
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© eiSos
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