May, 2021


www.us-tech.com


New Flexible R&D Wafer Plater from Technic


CRANSTON, RI — Technic has announced the newest addition to its Semcon line of equipment for wafer-level deposition. The


design orients the wafer in a more favorable horizontal posi- tion, mimicking most semicon- ductor mass production electro- plating tools. The Semcon Foun -


tain is capable of pro- cessing wafers up to 11.8 in. (300 mm) and utilizes a variety of wafer “cups” for differ- ent size wafers. The Semcon Fountain can achieve optimum pro- cessing for each appli- cation by adjusting the sparger, solution flow and shielding. Each diameter-dif-


Semcon Fountain wafer plating system.


Semcon® Fountain is the latest development in the highly suc- cessful Semcon series of wafer plating tools by Technic. Expanding on the populari-


ty of the Semcon 1000 for single wafer R&D processing and small-scale production, the Sem- con Fountain offers additional options and features. One significant feature is a


chamber design with a solution sparger that more closely resem- bles a full-scale production tool. The Semcon Fountain’s special


ferent cup allows for maximum tool flexibili- ty by being able to run different wafer sizes


using a single plating cell, mak- ing it extremely versatile and eco- nomical. The Semcon Fountain is


particularly useful when setting up an electroplating process for the first time, or when introduc- ing a new metal plating bath to an already existing electroplat-


ing process. Contact: Technic, 47 Molter


Street, Cranston, RI 02910 % 401-781-6100


E-mail: info@technic.com Web: www.technic.com


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