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www.us-tech.com


May, 2021


High-Mix and High-Volume Soldering from SEHO


To Be Strategic


CrimpCenter 64 SP


Produce Faster, More Precisely, and More Cost Effectively


The CrimpCenter 64 SP processes wires with conductor cross sections from 0.13 to 6 mm² and features the latest quality assurance options, such as SmartDetect, WireCam and Guided Feasibility Study, to ensure transparency and traceability of important production data. These features, along with a number of performance enhancements,   production with high quality requirements.


     


Reliable, high precision technology Increased effective performance Minimized setup times


 Optimized parameter settings Enhanced deposit quality


Wire Solutions for a Connected World


ERLANGER, KY — With the Se- lectLine platform, SEHO has de- veloped a selective soldering sys- tem that offers both high-mix and high-volume production and re- quires little floor space. The Se- lectLine provides high precision and solder joint quality, as well as


complete manufacturing line. It is expandable to include


up to six soldering units and more than 15 parallel worksta- tions in one system. The modular machine design and numerous configuration possibilities allow adaptation to nearly all produc-


SelectLine-C selective soldering system.


flexibility. No changeover is re- quired to process a variety of as- semblies with short cycle times, in either mini-wave processes or multi-wave soldering processes. The modular design of the


SelectLine-C enables it to be used for standalone operation or ex- panded with additional modules at any time for inline use. The modules can be individually con- figured with fluxers, preheaters, soldering units, cooling modules, selective brush systems and AOI and, depending on the require- ments, may be combined into a


tion requirements. Patented by SEHO, SYN-


CHRO software coordinates the soldering process for PCBs so that the total throughput is nearly dou- bled without the need for signifi- cant investment. Cycle times can be reduced by nearly 50 percent in


SYNCHRO operation mode. Contact: SEHO North Amer- ica, Inc., 1445 Jamike Avenue,


Suite 1, Erlanger, KY 41018 % 859-371-7346 E-mail: sehona@sehona.com Web: www.seho.de/en/north- america


schleuniger.com


Numerical Innovations Launches CloudDFM


LAS VEGAS, NV — Numerical Innovations has launched Cloud- DFM™, an easy-to-use web API that empowers anyone who wants to develop next-generation


electronic PCB manufacturing apps in the Cloud. CloudDFM is available online at any time, and easily integrates with all popular web frameworks, iOS and An- droid, allowing users to easily build online DFM checkers, viewers and more. The goal of DFM is to ensure


PCBs are built correctly the first time by limiting common manu- facturing mistakes and ensure all designs are ready for success- ful manufacturing. CloudDFM provides more than 85 essential DFM checks for this, resulting in lower manufacturing costs, im- proving product quality and pro- moting faster delivery. Cloud- DFM provides this capability in a unique way in the cloud. CloudDFM can also be fully


automated into a company’s con- tinuous integration workflow, by using the CloudDFM CAM pack- age add-on. With this tool, users can transform CloudDFM into an automated CAM/Gerber pow- erhouse for PCB manufacturing, including full-featured editing,


PCB panelization and more. Contact: Numerical Innova- tions, 6795 S Edmond Street,


Las Vegas, NV 89118 % 866-528-9274 E-mail: sales@numericalinnovations.com Web: www.numericalinnovations.com


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