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www.us-tech.com
May, 2021
ASM Rolls Out New SIPLACE TX micron
SUWANEE, GA — ASM’s new SIPLACE TX micron is designed to offer more speed, precision and flexibility for advanced pack- aging and high-density applications. With its improved 20-nozzle SIPLACE Speed - Star high-speed placement head, ASM has managed to raise the machine’s perform- ance by roughly 23 percent to up to 96,000 cph while increasing the component spec- trum by 37 percent. A single machine covers the three
precision classes of 25, 20 and 15 µm at three sigma, making it possible to operate with component pitches of as little as 50 µm and place 008004 (0201 metric) compo- nents at full speed. Special functions for thin-die han-
dling deliver significantly higher yields when assembling system-in-package mod- ules or submodules. Advanced packaging, which is one of
today’s key technologies in electronics production, blurs the lines between OSATs, IDMs and “classical” yet demanding SMT applications. In times of
SIPLACE TX micron pick-and-place system.
rising time, cost and efficiency pressures, the production of SiPs and SoCs as well as the processing of die and flip-chip modules on high-precision SMT plat- forms is becoming more common. ASM aims to meet the requirements of these complex applications with the new and heavily improved version of
SIPLACE TX micron. The new SIPLACE SpeedStar 20-seg-
ment high-speed head can now place up to 48,000 components per hour (cph) and the platform offers a placement performance of up to 96,000 cph. This is made possible by the new placement head as well as by another shortening of its travel paths with a more compact feeder control unit (FCU) and z-axis travel that has been shortened
3975 Lakefield Court, Suite 106, Suwanee, GA 30024 % 770-797-3189 E-mail:
ogden.mark@
asmpt.com Web:
www.asm-smt.com
to two millimeters. Contact: ASM Assembly Systems,
the
See at NEPCON China, Booth 1F60
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