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www.us-tech.com
May, 2021
Meeting EV Safety and Quality Demands with Exact Inspection and Measurement
By Axel Klapproth, Head of Customer Care X1, and Detlef Beer, Head of Product Development, Viscom AG
a simple good/bad process. Viscom is contin- uing to enhance its inspection technologies to deliver more precise measured values that increase the effectiveness of the inspection process. The trend toward electric mobili-
T
ty is increasing requirements for the durability and safety of electronic assemblies — and the stability of sol- der joints in particular. Quality inspections according to DIN 1319 allow an inspection object to be classi- fied simply as good or bad. This kind of inspection deter-
mines whether the characteristic val- ues fall within defined thresholds, or tolerances. However, these inspec- tions are not enough when it comes to evaluating voids, the filling level of THT solder joints, as well as the heights, positions and the alignment of components. Accurate measured values are
the only valid indicator of how well the IPC guidelines or a company’s own requirements are being main- tained. The same is true when it comes to the actual distance between
3D image showing wirebond inspection measurements.
he EV sector is demanding more sophisticated and high-quality inspec- tion of electronic assemblies far beyond
anodes and cathodes in lithium-ion batteries. Precise measurements are absolutely neces- sary.
Exact measured values reveal trends
and variations. This allows for a more effec- tive assessment of where the production
process needs to be readjusted and improved. Changes can be implemented before defects occur. The goal is for AOI and X-ray inspec- tions to continually relay information back to the paste printer and placement machine. The production systems regulate them- selves, and processes are optimized on an ongoing basis. But, the pre- requisites for this are very demand- ing, including a higher degree of measuring resolution and accuracy, a higher data rate and the rapid measurement and transfer of data to inline systems.
Measuring Voids Voids, or large cavities in solder
joints, can significantly shorten the service life of products. Voids have been shown to reduce the thermal and mechanical strength of solder joints (temperature cycles, shearing strength). In addition to power com- ponents and LEDs, this also affects BGAs, QFNs, transistors, and THT components. Voids are caused by a number of factors, such as contami- nation, the solder paste, melting behavior, the temperature profile in soldering ovens, and the selective
Continued on next page
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