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www.us-tech.com


May, 2021


From A to Z: Next-Gen AOI with Advanced Z-Axis Control


By Jeff Mogensen, General Manager, Saki America, Inc.


while delivering increasingly complex prod- ucts at consistently high quality. AOI must deliver enhanced capabilities to help meet these goals as new assembly techniques and demanding component technologies are introduced. The latest manufacturing trends, such


T


as the adoption of press-fit components and tall components, as well as the demand to simplify correction for board warpage to enable accurate inspection of components and solder joints, are challenging the ability of AOI to help manufacturers meet their tar- gets.


In particular, they tend to exceed the


usual limits of working distance and height measurement range that apply to typical AOI platforms in use today. In response, Saki has introduced expanded z-axis capabil- ities to its market-proven 3Di AOI systems, making a choice of enhanced z-axis available across the entire range of 7, 12 and 18 µm resolution with all conveyor models.


Current Trends and Challenges Components with press-fit or insulation-


displacement terminals have become popular CableEye®


ypical market pressures demand that manufacturers continually strive to raise throughput and reduce costs,


throughout the automotive sector and others. Connections are fast and easy to make, mechanically secure, and involve no solder-


inspection challenges arise. Various aspects of the pins must be inspected, including pin shift, pin height, the height difference between fork pins, and the fork pin inner dis- tance. These call for inspection over the full height of each pin, which is typically beyond the range that a typical AOI system can focus. As a result, assessment of pin tips can- not be accurate, which prevents AOI from detecting defects, such as bent pins or angu- lar displacement of the connector. Another trend is greater adoption of tall


components, such as large surface-mount or through-hole capacitors for applications in industrial control as well as automotive elec- tronics. In particular, achieving adequate depth of field to capture clear images for OCR on the upper surface of tall components is a challenge. In addition, novel assembly techniques,


Proper inspection of tall components is necessitating greater z-axis movement.


ing, which eliminates one possible cause of broken connections or latent defects due to dry solder joints. However, while the automotive industry is keen to capture these benefits, several new


such as PCB-on-PCB, are being used in equipment for telecom, 5G infrastructure and data center servers. Designed to enable increased system performance within the tight space constraints imposed by standard rack dimensions, stacked assemblies chal- lenge AOI systems in a similar way to the inspection of tall and press-fit components. Despite precise thermal control through-


Continued on page 63


All-in-One Test and Cable Management Maximum Flexibility for the Widest Range of Test Needs


Tester and Test Management  JavaScript  LabView Operator Work Instructions    


R&D  Prototyping  Production Batch Testing  High Mix Low Volume (HMLV)  Low Mix High Volume (LMHV) Testing


Production Mode 





 


 


  Data LoggingBatch Recording





Demo


Tester Management  Troubleshooting  Testing  PASS/FAIL Checks Continuity  Resistance  4 Wire  


Systems Available! CableEye and the CableEye Logo are Registered Trademarks of CAMI Research Inc. LabView is a Trademark of National Instruments Corp. JavaScript is a Registered Trademark of Oracle America, Inc.


®


CAMI Research Inc. CableEye® +1 978-266-2655 | sales@camiresearch.com


Automation-Ready, PC-Based System compatible with Win 7 or later & touch screen computers. Superb Customer Service !


     


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