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www.us- tech.com


May, 2019


Seica Showcases Flying Probe Test and Laser Selective Soldering Systems


Haverhill, MA — Seica is now show- casing its latest lineup of electronics test and assembly equipment, includ- ing the Pilot V8 flying probe test sys- tem, the Mini 200 benchtop ICT sys- tem and the Firefly Next> laser selec- tive soldering system. The new gener- ation of Next> series systems have a renovated and sleek design, due to the use of premium chassis materials and innovative electrical features. Seica’s industrial monitoring


solution “4.0 ready” monitors current absorption, supply voltage, tempera- ture, light indicators, and other parameters. These are useful to indi- cate correct operation, aid predictive maintenance and makes the compa- ny’s systems compatible with the new standards of Industry 4.0. The Pilot V8 is a complete flying


probe test platform. In its most equipped configuration, the tester offers up to 20 mobile test resources for a PCB, including probes that can supply up to 3A, high-resolution cameras for automated optical inspection, barcode reading, laser, capacitive probes, pyrometers, opti- cal fiber sensors for LEDs, flying con- nectors for boundary scan and on- board programming, and high-fre- quency probes for measurements


over 1.5 GHz. The Pilot V8 is available in a


fully-automated version, which makes its vertical structure suitable


All of the automation modules are standard and available in the Seica catalog. The HR (high-resolution) version of the Pilot V8 allows the sys-


hybrid channels. It offers customers an entry point into production test. In addition to the Mini 200 the


Compact TK is also available, which utilizes a built-in receiver for easy swap-out of fixtures. The Compact line has channel counts from 192 to 4,608 in a variety of manual, inline and combinational ICT and function- al test options. The new generation of Firefly


Next> series laser selective soldering systems is now available. This family of Firefly systems has an attractive and revamped appearance and offers significant technological improve- ments. The system is capable of sol- dering both the top and bottom of the PCB.


The Firefly combines four


essential innovations: a high-effi- ciency laser source; a new spot angle on the board to be soldered; fully pro- grammable donut spot size; and per- fect axial integration of the laser. With vision and continuous tempera- ture feedback, the system provides outstanding throughput compared


Pilot V8 flying probe test platform. for combination with board


loading/unloading modules capable of hosting from 1 to 12 magazines.


Indium8.9HF Solder Paste


Proven Halogen-Free Products for High-Reliability Applications


• Enhanced electrical reliabilibility • No dendritic growth


• Meets HKMC MS184-01 testing criteria (Type B)


• Low-voiding on bottom termination components


Exceeds All Requirements for Enhanced Electrical Reliability


Indium8.9HF


Minimum SIR requirement Time


Spacing Voltage


SIR coupon


askus@indium.com ©2019 Indium Corporation


Enhanced SIR Requirements


Standard SIR (J-STD-004B) Requirements


Standard SIR (J STD 004B)


R


5,000 MOhms 100 MOhms 1,000 hours 0.2mm


10V, 50V B52


168 hours 0.5mm 5V


B24


Learn more: www.indium.com/USTA Contact our engineers:


See at SMTconnect, Hall 5 Booth 310 and PCIM, Hall 6 Booth 108


tem to test very small objects, down to 1.2 mil (30 µm), while the XL ver- sion expands the work area from the standard 24 x 21.3 in. (610 x 540 mm) to 31.5 x 25.6 in. (800 x 650 mm) in size. Seica’s small, compact, econom-


ical in-circuit test system, the Mini 200, is a benchtop unit with up to 768


with previous generations. Contact: Seica, Inc., 110 Avco


Road, Haverhill, MA 01835 % 603-890-6002


E-mail: davidsigillo@seicausa.com Web: www.seica-na.com


See at NEPCON China, Booth 1E55, and at


SMTconnect, Hall 4A Booth 300


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