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www.us- tech.com


May, 2019


Viscom: Ultra-Fast Inspection for Concealed Solder Joints


Duluth, GA — Viscom’s extremely fast PCB transport system, xFast - Flow, is now available for inline X- ray inspection (3D AXI). The solution is used in the company’s X7056-II inspection system. The X7056-II meets the demand


of electronics manufacturing compa- nies for the combination of extremely fast assembly handling with optimal quality control. The inline X-ray sys- tem can be extended with additional


automatic optical inspection (3D AOI) within its existing housing. With xFastFlow, the machine achieves han- dling times (in-feed and out-feed of the object to be inspected) of down to four seconds. Up to three PCBs can be processed simultaneously. High-performance flat-panel de -


tec tors — depending on the configura- tion either fixed or movable — con- tribute to high-quality 3D X-ray images. With the help of planar com-


puter tomography, both hori- zontal and vertical layer images that no longer show any disrup- tive structures, in contrast to 2D results, can be extracted from the data volume. The system can show


slice-by-slice views of the interi- or of an array of BGA balls, for example. “Head-in-pillow” errors in


BGA components or voids in surface soldering can be quickly and reliably detected. Depen - ding on the requirements, inspection depth and through- put, as well as 3D and 2D inspection, can be combined. The system is operated


with user-friendly vVision soft- ware from Viscom and offers networking options within quality assurance processes during manufacturing, making it suitable for Industry 4.0 and the


smart factory. Contact: Viscom Inc., 1775


Breckinridge Parkway, Suite 500,


Duluth, GA 30096 % 678-966-9835 fax: 678-966-9828


X7056-II inspection system.


E-mail: info@viscomusa.com Web: www.viscomusa.com


See at NEPCON China, Booth 1J20, and at


SMTconnect, Hall 4A Booth 120


THERE ARE SEVERAL WAYS TO REDUCE MOISTURE RISKS


Microbond™ See at SMTconnect, Hall 4 Booth 149 Maximized reliability in fine pitch applications SMT650 Solder Paste See at SMTconnect, Hall 4 Booth 240 and PCIM, Hall 9 Booth 533


Find out more at SMTconnect


Hall 4 Booth 4-240


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