May, 2019
www.us-
tech.com Automated Selective Soldering SEHO Offers Easy Path to
Erlanger, KY — SEHO is now offering its StartSelective, which is ideally suit- ed for those just entering automated soldering. The machine is fully equipped to start production immediately. The StartSelective is has been designed for ease of
operation, requiring minimal skills, as well as many tech- nical highlights. With a footprint of only 27ft2 (2.5m2), the StartSelective provides quality and reproducibility of sol- dering results for assemblies up to 20 x 20 in. (50.8 x 50.8 cm) and an outstanding return on investment. The com- pact design allows users to integrate the machine in any production island, or to place it as standalone system in the corner of the production floor. Loading and unloading of assemblies is done man-
ually. All process steps are fully automated and moni- tored. All process-relevant components, such as the micro drop jet fluxer, preheat system and maintenance-free electromagnetic soldering unit have been in use for many years in SEHO’s systems. The bottom-side preheat section
of the StartSelective is equipped with pulsar heaters over the full area, which offer a high energy density and quick reaction time. An additional top-side IR preheater ensures perma- nent and controlled heat support dur- ing long cycles to guarantee constant process conditions. The electromagnetic soldering
unit has a 7° soldering angle. It is suit- able for the use of non-wetted mini- wave nozzles with directed solder flow.
Tualatin, OR — LPKF’s new laser- induced deep etching (LIDE) process can create deep microstructures in glass, without causing microcracks, stress or other surface defects. Due to its properties, glass is one of the most interesting materials for advanced IC and wafer-level packaging applica- tions. For a long time, glass was very difficult to process. Production-related surface defects have given it a reputa- tion of being brittle and susceptible to fracture, making it suitable only for simple packaging tasks. The new process, however, is fast and precise. According to the company, with
integration of advanced IC and wafer-level packag-
LPKF: Laser Induced Deep Etching for Thin Glass
This provides excellent solder peel-off and effective reduction of possible solder- ing defects, even with difficult board layouts. The solder nozzles have stable and reproducible flow properties, are maintenance-free and offer a nearly unlimited lifetime. A spray jet in the fluxing area, automatic wave
height control and solder level monitoring with auto- mated solder wire supply are among the system’s
automated process control features. Contact: SEHO North America, Inc., 1445
Jamike Avenue, Suite 1, Erlanger, KY 41018 % 859-371-7346 fax: 859-282-6718
E-mail:
sehona@sehona.com Web:
www.seho.de/en/north-america
StartSelective selective soldering system.
See at NEPCON China, Booth 1D12, and at SMTconnect, Hall 4, Booth 129
™
Page 79
HIGH PERFORMANCE
Color Keyed SMT Test Points
the use of LIDE-processed glass, more opportunities are available in heterogeneous
Color Keyed for visibility and quick identification Ideal for production testing and service troubleshooting
Glass etched by laser-induced deep etching (LIDE).
ing. LPKF Laser & Electronics man- ufactures laser systems used in cir- cuit board, microelectronics fabrica-
tion and TGV formation. Contact: LPKF Laser &
Electronics, 12555 S.W. Leveton
Drive, Tualatin, OR 97062 % 503-454-4200 E-mail:
ataylor@lpkfusa.com Web:
www.lpkfusa.com
See at SMTconnect, Hall 5 Booth 434B
www.keyelco.com (516) 328-7500 (800) 221-5510 REQUEST CATALOG! See at EDS, Conference Unit 215 11:14 AM
Wire loop provides convenient access point for J-hooks and test probes Manufactured from Phosphor Bronze with Silver Plating and High Temperature Nylon Insulator Silver Plating allows for superior solderability and low electrical resistance High Temperature Nylon Insulator designed for SMT reflow soldering Supplied on Tape and Reel
IT’S WHAT’S ON THE INSIDE THAT COUNTS ® ELECTRONICS CORP.
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