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May, 2019


The Convergence of the Semiconductor and SMT Markets


Continued from page 66


over-year in the fourth quarter by the competitive advantages of the MRS technology platform. With its rich patent portfolio and


key technology platforms addressing challenging applications across the SMT, semiconductor and industrial metrology markets, CyberOptics is well-positioned for continued solid growth and profitability over the next three to five years.


ly. According to Yole Developpement, the advanced packaging market rev- enue is projected to grow from around $28 billion in 2019 to around $33 billion in 2022. With all of the complexity, variations of packaging types and continued advancements, yield challenges are increasing. Right now, the industry is demand- ing high accuracy, high resolution and higher speed for 100 percent inspection. Volumes are increasing


The SQ3000 system addresses AOI, SPI and coordinate measurement. MRS technology has allowed


the company to strengthen its posi- tion in existing SMT markets and participate in the backend semicon- ductor market, where its MRS sen- sors are integrated into KLA®’s back- end inspection systems. The compa- ny has further extended the technol- ogy into the mid-end semiconductor market where it sees a large growth opportunity in advanced packaging. MRS sensors can measure cracks


and defects as small as 30 microns in size. This is important as electronics packaging continues to shrink, compo- nents are more densely combined on circuit boards, tall components are placed near small components and various new stacking technologies grow in popularity. All of these are driving the need for high-precision inspection and measurement.


Mid-End Semiconductor There are various definitions in


the market, but features that are larger than 100 microns are typically seen in the backend semiconductor area. Features that are smaller than a single micron are seen in the fron- tend area, and everything in between is generally referred to as the broad, mid-end area. There is a plethora of activity in


the mid-end and advanced packaging market, whether it is wire bonding, stacked die, copper pillars or C4 sol- der bumps. Advanced packaging, where dice are integrating vertically, involves finer features with more lay- ers and I/Os. There are various stacking tech-


nologies; whether it is fan-in or fan- out and the packaging of the dice is still done on the wafer, embedded dice, or through-silicon vias (TSVs), it is clear that there is a growing need to effectively identify and con- trol defects. The mid-end and advanced packaging market is growing quick-


See at NEPCON China, Booth 1D12 and SMTconnect, Hall 4 Booth 129


in this area, due to stacking and other advanced packaging applica- tions, making speed a critical factor.


MRS Sensor Advancements In 2015, when CyberOptics


launched its MRS technology, its pixel was 18 microns. From 18 microns it has come down to three microns. In four years, the technology has ad - vanced by a factor of six. In addition, its three-micron sensor is capable of handling specular surfaces. Along side the improvement in resolution, the company has also added the ability to handle mirror-like surfaces. CyberOptics’ latest MRS sensor


is excellent for the mid-end inspec- tion area. Typically, there is a factor of ten to one — the three-micron sen- sor can deliver high precision, accu- racy and resolution for features down to 30 microns in size. The big differ- entiator is the high resolution and accuracy that the industry needs, and the speed advantage. Cyber - Optics’ sensor technology is two or three times faster than alternate solutions in the marketplace. Going forward, CyberOptics will


continue to advance its sensor technol- ogy with various levels, including improvements in pixel size and fur- ther advancements in its proprietary MRS algorithms —the secret sauce. In the future, the company anticipates delivering sub-one micron resolution for features smaller than five microns to start approaching the front-end semiconductor area. Contact: CyberOptics Corp.,


5900 Golden Hills Drive, Minneapolis, MN 55416 % 952-820-5837 E-mail: cfuranna@cyberoptics.com Web: www.cyberoptics.com r


See at NEPCON China, Booths 1E52 and 1E54


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