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www.us- tech.com


May, 2019


Electronic Materials put Automobiles on the Road to Safety, Comfort and Fuel-Efficiency


By Holger Schuh, Thermal Interface Material (TIM) Business Development Manager — EIMEA, Henkel Corporation T


he demand to make cars safer, more fuel-efficient, environ- mentally-friendly, comfortable,


intelligent, connected and reliable is fueling the growth of automotive electrification. Whether


it be


advanced driver assistance systems (ADAS), emerging so-called “autopi- lot” cars, new battery technology for electric and hybrid electric vehicles, or slick infotainment systems — all of this comes down to next-generation electronics integration. In fact, the vast majority of inno-


vation occurring in the automotive sector today has to do with electronics innovation. In order for all of these systems to perform as expected, robust materials that connect, protect and cool everything from lithium-ion (Li-ion) batteries, camera systems and radars to engine control units and everything in between are required.


ADAS: A Safer Ride Milestones on the way to driver-


less vehicles are being marked at breakneck speed, with ADAS as key enablers, allowing acceleration and authentic autonomous


control.


Forward-collision and lane departure warnings, parking assistance, rear monitoring, blind spot detection, adaptive cruise control, and night vision systems are now relatively common in current car models. Beyond the gadget and “cool”


appeal of ADAS are measurable ben- efits for the global population, with safety being top among them. Already, implementation of ADAS technology has had a profound impact on automotive safety. Passive ADAS, which includes post-crash protection, such as air bags and seat- belts, has cut fatalities nearly in half over the last 40 years. With active and predictive


ADAS now enabling greater collision prevention, it is expected that as self- driving cars become common, traffic fatalities could drop by as much as 90 percent. Potentially this could save as many as 10 million lives per decade. For leading materials suppliers, all of this is welcome, though not sur-


prising, news. For example, Henkel’s high-impact solutions and process expertise have played central roles in the facilitation of today’s advanced automotive electronics and, in particu- lar, ADAS. In fact, within every ADAS


Making ADAS Work At the foundation of each ADAS


product is a printed circuit board (PCB) that enables electronic capabili- ty. Here, a full range of materials for


effectively dissipate the resulting ther- mal load a top priority. Insulated metal substrates


(IMS) help alleviate heat produced at the board level in devices that include power steering modules, while Henkel’s BERGQUIST® GAP PAD® and liquid gap filler thermal interface materials move heat away from active components. Without these critical materials, overheating would result, which could ultimately mean device failure. Outside of the PCB, electrically


conductive inks and robust adhesives are found in other parts of various ADAS devices, such as vision sys- tems. For the multiple cameras — as many as 10 per car — that are onboard today’s ADAS-equipped vehicles, non-conductive adhesives are used to bond the various lenses and housings, providing strong adhe- sion for failure-resistant function. These, in addition to a multitude of other electronic materials are essen- tial for camera capability. Advanced display designs and


human-machine interface (HMI) technologies play a key role in enhancing passenger comfort and infotainment. Innovative optical bonding materials allow automotive system suppliers to improve visual clarity of these displays.


Real-Time Data Analysis Behind all of the image capture,


A variety of adhesive, thermal interface and shielding materials are needed in the cameras of today’s ADAS-equipped vehicles.


product — from passive seat-belt and air bag sensors to predictive forward collision avoidance systems — high- performance materials are integral to function and long-term reliability. Advanced electronic materials, such as thermal interface materials (TIMs), conductive inks, gasketing, potting, bonding and coating solutions are all necessary for dependable, efficient system performance.


the entire PCB assembly materials ecosystem is required. Advanced sol- der pastes facilitate robust connection of components to the board substrate, and underfill materials are dispensed beneath array devices, such as BGAs and CSPs, to protect the delicate sol- der joints and provide long-term relia- bility. These PCBs are packing more power into increasingly smaller spaces, making the requirement to


braking function and blind spot detection indicators is the need to churn the data, analyze and respond in real time for effective accident pre- vention. This is the role of proces- sors, analog integrated circuits (ICs) and discrete power devices, which encompass some of the powerful com- ponents of modern ADAS chipsets. The increase of semiconductor


content in automobiles — which Intel projects could have a market size of nearly $70 billion for autonomous auto systems, data and servers by 2030 —is the driver behind the slew of chipmak- ers investing in leading automotive technology firms. Intel’s recent deci- sion to acquire camera and laser-


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