Page 72
www.us-
tech.com
May, 2019
X-Ray Component Counters Boost Revenue and Reduce Downtime
Continued from previous page
be labeled to communicate with the material management system. The
management system, cut costs and improve line uptime.
machine is able to recognize the loca- tion of the old label and to place the new label over it, eliminating any confusion. With this type of machine, all component counting personnel can be relocated elsewhere on the shop floor. By using X-ray component
counting systems, any size company can boost the accuracy of its material
AXI-5100c II automated, inline X-ray component counter. Contact: Scienscope
International, 5751 Schaefer Avenue, Chino, CA 91710 % 603-426-6172 E-mail:
djeka@scienscope.com Web:
www.scienscope.com r
See at NEPCON China, Booth 1H15, and at SMTconnect,
Hall 4A Booth 148
DL Technology has been the leader in micro dispensing technology for over 15 years. For more
www.dltechnology.com 216 River Street, Haverhill, MA 01832 • P: 978.374.6451 • F: 978.372.4889 •
sales@dltechnology.com
Real-Time Risk Mitigation in Hand Soldering...
Continued from page 69
of the solder joint as well as the output of the operator. This simple solder joint demonstration was considered revolu- tionary by the participants and the cre- ators of the CFX standard. Not one of the industry experts had ever consid- ered the possibility of monitoring the
hand soldering process. Questionable solder joints remain
a constant source of printed circuit board failure. Typically, the reliability of the connection relies on visual inspection, operator influence and skill. Each factor involved with the for- mation of a solder joint is an element of risk and can affect either throughput or reliability. Mitigating the risk in hand soldering requires the identifica- tion of these factors —and with the CV system — a means to control them. The time to correct defects is
during the initial soldering process. After the soldering process is com- pleted, we as an industry cannot rely on inspections performed by humans or machines to confirm solder joint formation to a standard. The highest point of risk is during the soldering operation and is the formation of the intermetallic compound. Visual inspection and operator skill do not verify the correct formation of the intermetallic compound within the solder joint. It is time to consider a closed-loop soldering system with CFX compatibility for process control and traceability. The overall success and quality
of IPC-CFX is a testament to the innovation and growth taking place in the electronics industry. For the first time ever, all machines of all types from all vendors are able to use a single language, protocol and encoding method to eliminate all cus- tom interpreters and any possibility of error to share real-time data. Contact: Metcal, 10800 Valley
See at NEPCON China, Booth 1G51 and SMTconnect, Hall 4A Booth 324
View Street, Cypress, CA 90630 % 714-799-9910 E-mail:
na-custcare@okinternational.com Web:
www.okinternational.com/metcal r
Page 1 |
Page 2 |
Page 3 |
Page 4 |
Page 5 |
Page 6 |
Page 7 |
Page 8 |
Page 9 |
Page 10 |
Page 11 |
Page 12 |
Page 13 |
Page 14 |
Page 15 |
Page 16 |
Page 17 |
Page 18 |
Page 19 |
Page 20 |
Page 21 |
Page 22 |
Page 23 |
Page 24 |
Page 25 |
Page 26 |
Page 27 |
Page 28 |
Page 29 |
Page 30 |
Page 31 |
Page 32 |
Page 33 |
Page 34 |
Page 35 |
Page 36 |
Page 37 |
Page 38 |
Page 39 |
Page 40 |
Page 41 |
Page 42 |
Page 43 |
Page 44 |
Page 45 |
Page 46 |
Page 47 |
Page 48 |
Page 49 |
Page 50 |
Page 51 |
Page 52 |
Page 53 |
Page 54 |
Page 55 |
Page 56 |
Page 57 |
Page 58 |
Page 59 |
Page 60 |
Page 61 |
Page 62 |
Page 63 |
Page 64 |
Page 65 |
Page 66 |
Page 67 |
Page 68 |
Page 69 |
Page 70 |
Page 71 |
Page 72 |
Page 73 |
Page 74 |
Page 75 |
Page 76 |
Page 77 |
Page 78 |
Page 79 |
Page 80 |
Page 81 |
Page 82 |
Page 83 |
Page 84 |
Page 85 |
Page 86 |
Page 87 |
Page 88 |
Page 89 |
Page 90 |
Page 91 |
Page 92 |
Page 93 |
Page 94 |
Page 95 |
Page 96 |
Page 97 |
Page 98 |
Page 99 |
Page 100 |
Page 101 |
Page 102 |
Page 103 |
Page 104 |
Page 105 |
Page 106 |
Page 107 |
Page 108 |
Page 109 |
Page 110 |
Page 111 |
Page 112 |
Page 113 |
Page 114 |
Page 115 |
Page 116 |
Page 117 |
Page 118 |
Page 119 |
Page 120 |
Page 121 |
Page 122 |
Page 123 |
Page 124
