August, 2016
www.us-tech.com
Panacol Intros Plastic Adhesive in Multiple Viscosities
Steinbach, Germany — Panacol, an international supplier of adhesives, has introduced a UV adhesive, which has been formulated specially to bond plastics and is available in three different viscosities. The appropriate viscosity can be chosen
depending on the application: Vitralit® 7311 has an extremely low-viscosity and thus a good choice for tight bond gaps. Vitralit 7311 T has a midrange viscosity, and Vitralit 7311 Gel demonstrates high- viscosity, non-flowing properties. All three variations of Vitralit 7311 provide
excellent adhesion to most plastics, including PC, PVC and PMMA, as well as to metal and glass. Vitralit 7311 is transparent and non-yellowing. It is resistant to alcohols and humidity. Once cured, the adhesive will be visco-plastic. For use in medical applications the adhesive is currently being tested according to USP Class VI and DIN ISO 109934/5 standards. The material cures in seconds
Indium: Void Reducing Solder Pastes
Clinton, NY — Indium Corporation has specifically formulated Indium 10.1 solder paste to reduce voiding significantly below the industry average to improve the reliability of finished goods. Indium10.1 delivers robust reflow capabilities and a wide processing window, which accommo- dates various board sizes and throughput requirements and mini- mizes defects. For a halogen-free option, Indium8.9HF solder paste delivers
UV-curing plastic adhesive.
with ultraviolet or visible light. For excellent cur- ing results high-intensity LEDs at 405 nm wave-
length are recommended. This wavelength also permits the bonding of UV-blocked materials like polycarbonate. Vitralit 7311, as an example, can be used for
needle bonding in medical device manufacturing. Cured with a Bluepoint LED eco light source from UV manufacturer Hönle, the material achieves high bond strength in less than a second, providing
reliable and durable bonds. Contact: Panacol-Elosol GmbH,
Daimlerstrasse 8, 61449 Steinbach, Germany %+49-0-6171-6202-580 E-mail:
juliane.seiber@
panacol.de Web:
www.panacol.com
Page 63
Indium’s solder pastes are formulated to reduce voiding.
very low voiding. Its oxidation barri- er technology makes it suitable for a variety of applications, especially in automotive assembly. In addition to its excellent print
transfer and response-to-pause, In - dium10.1 and Indium8.9HF both provide good pin-in paste solderabili-
ty and hole-fill. Contact: Indium Corp., 34
Robinson Road, Clinton, NY 13323 % 315-381-7524
E-mail:
abrown@indium.com Web:
www.indium.com
See at NEPCON South China, Booth 1M10
See at NEPCON South China, Booth 1G22
Page 1 |
Page 2 |
Page 3 |
Page 4 |
Page 5 |
Page 6 |
Page 7 |
Page 8 |
Page 9 |
Page 10 |
Page 11 |
Page 12 |
Page 13 |
Page 14 |
Page 15 |
Page 16 |
Page 17 |
Page 18 |
Page 19 |
Page 20 |
Page 21 |
Page 22 |
Page 23 |
Page 24 |
Page 25 |
Page 26 |
Page 27 |
Page 28 |
Page 29 |
Page 30 |
Page 31 |
Page 32 |
Page 33 |
Page 34 |
Page 35 |
Page 36 |
Page 37 |
Page 38 |
Page 39 |
Page 40 |
Page 41 |
Page 42 |
Page 43 |
Page 44 |
Page 45 |
Page 46 |
Page 47 |
Page 48 |
Page 49 |
Page 50 |
Page 51 |
Page 52 |
Page 53 |
Page 54 |
Page 55 |
Page 56 |
Page 57 |
Page 58 |
Page 59 |
Page 60 |
Page 61 |
Page 62 |
Page 63 |
Page 64 |
Page 65 |
Page 66 |
Page 67 |
Page 68 |
Page 69 |
Page 70 |
Page 71 |
Page 72 |
Page 73 |
Page 74 |
Page 75 |
Page 76 |
Page 77 |
Page 78 |
Page 79 |
Page 80 |
Page 81 |
Page 82 |
Page 83 |
Page 84 |
Page 85 |
Page 86 |
Page 87 |
Page 88