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www.us-tech.com
Irvine, CA — Henkel has developed and launched the latest product in its line of GAP PAD thermal interface materials (TIM). The new GAP PAD HC 5.0 is designed to manage the heat generated by today’s reduced form factor, high power density components. A soft and compliant gap-filling material,
GAP PAD HC 5.0 has a thermal conductivity of 5.0 W/m-K and delivers excellent thermal perform- ance with low compression stress. The low modu- lus and unique filler package is suitable for appli- cations that require minimal component or board stress during assembly, yet demand high heat transfer across the interface with low thermal re- sistance. GAP PAD HC 5.0 is the next generation of high compliance, soft gap-filling materials that
August, 2016 Henkel Intros Latest Thermal Interface Material GAP PAD HC 5.0 thermal interface material.
provide interfacing and wet out even to rough sur- faces and topographies, which ensures uniform material coverage across the component and heat sink for maximum performance. With high compli- ance materials, low thixotropic stress during as- sembly and through power and thermal cycling, the material minimizes pressure and potential damage to solder interconnects. According to the company, when compared with previous materials, GAP PAD HC 5.0 offers better handling, an en- hanced dielectric constant, improved volume resis- tivity and better thermal impedance performance. Manufactured with a natural tack on both sides, the material contains no thermally-impeding ad- hesive layers and is available in a range of thick- nesses from 0.5 to 3.2 mm (0.02 to 0.13 in.). Rein- forced with fiberglass for shear and tear preven- tion, the new material is said to be
highly durable. Contact: Henkel Electronic Ma-
terials LLC, 14000 Jamboree Road, Irvine, CA 92606 % 714-368-8000 fax: 888-943-6535 E-mail:
doug.dixon@henkel.com Web:
www.henkel.com
Kolb Cleaning Develops Concentrated Detergent
Longmont, CO — Kolb Cleaning Technology USA has developed a new concentrated cleaning deter- gent, MultiEx® VRSP-CN. The clean- ing detergent is an aqueous, alkaline broadband, multifunctional deter-
Kolb MultiEx® multi-purpose cleaning detergent.
gent that is well-suited for multiple cleaning tasks including PCBs, sten- cils, solder carriers and frames, and production tools. Alkaline cleaning agents are
widely used for today’s electronic as- semblies, and have been proven ef- fective at low temperatures and low concentrations. The Kolb MultiEx VRSP-CN contains organic inhibitor additives that form a thin chemical bond layer to protect sensitive met- als, such as copper or nickel alloy, from potential electromechanical de- terioration, thus safeguarding the assembly from possible field failures caused by metal corrosion. The chem- ical bond will increase the electrical resistance of the metal surface. The development of the MultiEx
VRSP-CN is in response to customer demand for a concentrate formula- tion of the popular VRSP ReadyMix. According to the company, the VRSP- CN is factory tested and qualified and outperforms equivalent cleaning
chemistries at a competitive price. Contact: Kolb Cleaning Technol- ogy USA, LLC, 410 Sunset Street,
Unit C, Longmont, CO 80501 % 970-532-5100 fax: 970-532-5101 E-mail:
patty.chonis@
usa.kolb-ct.com Web:
www.kolbcleaningusa.com
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