August, 2016
www.us-tech.com
JTAG Launches Adapters for DIMM and SODIMM Sockets
Easton, MD — JTAG Technologies, a specialist in board (PCBA) test solutions based on JTAG and IEEE 1149.x standards, has launched a new fami- ly of hardware adapters specifically designed for testing of a variety of DIMM and SODIMM sockets (sizes and styles) using a JTAG/boundary-scan controller and supporting software. The problem of testing DIMM memory sockets
has always been troublesome for test and produc- tion engineers using JTAG/boundary-scan systems. Even when it is possible to create memory writes and reads from the boundary-scan-compliant access device on the unit under test (UUT), the initializa- tion process may fail leaving users with little diag- nostics information. Also, users may still be uncer- tain as to whether the fault lies with the DIMM module itself or the socket. Using the new JT 2127-Flex system from JTAG Technologies, customers get pinpoint diagnostics from a known-good test interface to be cer- tain if a socket is soldered correctly. The modular system contains two
basic elements: a high-speed, multi- channel I/O module — JT 2127/DMU, and a personality adap ter for the cho- sen DIMM type — JT 2127-Flex. The combination of the DMU and Flex adapter allows test signals to be sent to and from the boundary-scan source device on the UUT and perform a thor-
Shenmao Intros BGA and Micro BGA Solder
ough check for open pins and short circuits. In addi- tion, the voltages on the power pins of the DIMM
sockets are also measured. Currently supported DIMM types are xxx = 204-3, 244-mi3, 260-4, and 288-4. The system can also be configured easily to support other formats. Software support for test developments is
provided through JTAG’s ProVision developer suite, which is shipped with a full set of support files for the new system. Complete DIMM socket test applications will also run on the full range of PIP runtime software modules and symphony sys-
tems where appropriate. Contact: JTAG Technologies, Inc., 111 N
DIMM memory socket adapter for boundary-scan test.
West Street, Suite A, Easton, MD 21601 % 410-770-4415 fax: 410-770-4774
E-mail:
info@jtag.com Web:
www.jtag.com
Page 25
Spheres San Jose, CA —Shenmao, a worldwide solder materials producer, has intro- duced a line of BGA and micro BGA solder spheres. The solder spheres are made for PBGA, CBGA, CSP, and flip chip assemblies by ultra-micron tech-
Solder spheres for PBGA, CBGA, CSP, and flip chip assemblies.
nology (UMT) out of highly-pure met- als. The alloy compositions are created by using piezoelectric droplet jet tech- nology in high volumes with accurate diameter uniformity, bright surface finishes and high-quality sphericity. Various diameters from 0.75 down to 0.05 mm (0.03 to 0.002 in.) are avail- able at affordable prices. The company’s high drop resist-
ance alloy, PF902-S (SAC0307X) has been developed to greatly increase the reliability and performance dur- ing portable electronic drop tests. In addition to solder spheres, the com- pany also manufactures SMT solder paste, wave solder bar, solder wire and flux, solder preforms, semicon- ductor packaging solder spheres, wafer bumping solder paste, dipping
flux, and PV ribbon. Contact: Shenmao America,
Inc., 2156 Ringwood Avenue, San Jose, CA 95131 % 408-943-1755 E-mail:
usa@shenmao.com Web:
www.shenmao.com
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