August, 2015
www.us-
tech.com
Wisconsin Manufacturing and Technology Show Set for October
Hartland, WI — Wisconsin manu- facturers, job shops, engineers, and industry professionals involved in the metal cutting and fabricating industries should plan to attend the 14th biennial exclusive manufactur- ing event October 6 through 8 at the Exposition Center at Wisconsin State Fair Park. The Wisconsin Manufacturing & Technology Show (WIMTS) will present hundreds of world-class exhibitors demonstrating the latest in advanced manufactur-
SMTAI Keynoters
Continued from previous page
national on Monday, September 28, from 12:30 pm - 1:30 pm. A new wave of wearables brings
with it plenty of manufacturing and process development concerns. In his keynote lunch presentation, Murad Kurwa will discuss substrate ad - vances like stretchable conductive fabrics, interconnects, new sensor technology including printed sensors (ECG) and OLED, assembly con- cerns for flexible conductive adhe- sive and nano-sintering, and encap- sulation techniques such as low pressure molding and waterproof coating. New equipment like R2R printing and assembly, laser fabric cutting, and ultrasonic welding on fabric will be discussed. The presen- tation will also address how reliabil- ity testing has adapted with flexibil- ity testing, washability, salt spray, and sweat testing. Also on Monday, September 28,
during the 12:30 pm -1:30 pm lunch- eon hour, another keynoter, Jim Springer of John Deere Electronic Solutions, will talk about “Extreme Environment Electronics: Where We’ve Been, Where We Are Going and What Could Be Next.” To feed the world’s population in 2050, esti- mates are that today’s agricultural production must double. Technology is critical to increas-
ing agricultural equipment’s utiliza- tion and output leading to more effi- cient farming methods and improved yields. The quality and reliability of electronics used for precision guid- ance, sensing, controlling engines and other key technologies is essential to optimizing equipment performance. Improving reliability in electron-
ics used in farming is challenging, both in electronic design and manufac- turing as well as material selection. This has become more apparent fol- lowing the global transition of elec- tronic manufacturing from the con- ventional leaded component technolo- gy to lead-free technology. Mr. Springer will provide a genesis and the evolution of electronics designed for use in harsh physical and electrical environments, particularly those used in farming and automotive industries. Examples of ruggedization protocols will be discussed. Contact: SMTA, 5200 Willson
Rd., Suite 215, Edina, MN 55424 952-920-7682 fax: 952-926-1819 Web:
www.smta.org
NEW IN 2015: EVENING JOB SHOP RECEPTION!
ing technologies and solutions. One of the largest machine tool and manufacturing shows
Wis_consin, WIMTS brings machin- ery up and running by industry-lead- ing builders, relevant keynote speak- ers, a new automation and technology pavilion, technical seminars, net- working events, and new interactive opportunities. Attendees will see new products in person, hear experts share business-changing innovations, and make connections that can increase their company's profitability. Contact: The Wisconsin
Manufacturing & Technology Show, c/o Expo Productions, Inc., 510 Hartbrook Drive, Hartland, WI 53029 % 262-367-5500 Web:
epishows.com/wmts
in
Page 85
MEPTEC and SEMI Jointly Present Symposium
Santa Clara, CA — MEPTEC is part- nering with SEMI to stage a two-day symposium, “The Great Miniaturiza - tion: Systems and Packaging” to be held on November 10-11 at the Biltmore Hotel in Santa Clara, CA. Device integration, and espe-
cially advanced packaging, drive electronic systems personal mobility — in your pocket, on your wrist, inside your body, in your home, in your car dashboard, almost every- where. These systems must sense, collect process data, communicate, and manage its use of power. As these electronics proliferate,
highly-integrated electronic systems all the way to the cloud must accom- modate this tsunami of data pro- duced by mobile, wearable, and remote sensing. Packaging technolo- gies, manufacturing solutions, as
well as the business models that sup- port production, must evolve to meet the challenges that this new era of mobile miniaturization will produce. The first day of the symposium
will address the applications that drive the technology; the second day will cover emerging technologies and a wrap-up panel discussion.
Day One — Applications: l
lCommunications. l
lMedical/Wearables/Diagnostics. lAutomotive.
Day Two — Technologies: l
Modules. l
lManufacturing for SiP and
Multi-die System Integration Co-design.
Multi-die System Integration.
Updates on Packaging Standards. For info:
www.MEPTEC.org
Power Management and Energy Harvesting.
WESTEC is the event of choice for West Coast manufacturers looking for solutions that will improve operations, lower costs, and meet higher customer expectations. At WESTEC 2015, you will:
• Connect with industry experts and peers at keynotes, presentations, and networking activities
• Explore innovative technologies, equipment, and processes on the exhibit floor
• Identify new ways to manufacture through product demonstrations, social interactions, and consultations with experts
WESTEC delivers the trusted solutions you need to keep your business competitive and successful.
Register Today!
ATTEND. EXHIBIT. SPONSOR. 800.733.3976
WESTEConline.com
#westec
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