August, 2015
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Page 63 Rehm: Vacuum Soldering Systems
Blaubeuren-Seissen, Germany — Rehm Thermal Systems is showing its energy-efficient, low-main- tenance and void-free convection Reflow Soldering System VisionXP+. The vacuum option is particu- larly noteworthy, since the usual method has been to remove voids and pores at the soldering point with an external vacuum module. Rehm’s system integrates vacuum into the VisionXP+ Vac system. The integrated vacuum means that gas inclu-
sions can be reliably eliminated inline during the convection soldering process. Outstanding solder- ing is made possible, without interrupting the work process — an excellent two-in-one solution. The efficient energy design also ensures sustain- able production. VisionXP+ scores with clear benefits. An even
more efficient transmission of heat and fewer emissions facilitate environmentally friendly pro- duction and thereby reduce operating costs. Optimum insulation and the innovative gas regu- lation ensure reduced loss of heat and a lower consumption of nitrogen dur- ing the processes. In all further devel- opments of the systems, Rehm Thermal Systems focuses at all times on the efficient handling of materials and resources. With VisionXP+, customers can
save up to 20 percent in energy dur- ing production and generate an aver-
age of 10 tons less CO2 per year. The new vacuum model makes
void-free convection soldering possi- ble in just one process, reliably removing pores, gas inclusions and voids during the soldering process, while the solder is still in an ideally molten state. With a negative pres- sure of up to 2 mbar, void rates of below 2 percent are possible.
Mornsun Intros Power Module for
SiC MOSFET Milford, MA — New from Mornsun, this power module for SiC MOSFETs is resistant to high pressure, con- sumes very little power, while pro- viding the high-speed switching needed to greatly enhance the power conversion efficiency of high-voltage inverters. Mornsun QA01C module offers ultra-high isolation voltage of 3500VAC and ultra-low isolation capacitance of 3.5pF, effectively pre-
Reflow soldering system works with and without a vacuum.
Pressure and speed can be regulated individ- ually. This integrated solution enables a time-effi-
cient and stable production process. Costly rework- ing of the sub-assemblies by an external vacuum system is no longer necessary as the work pieces are handed over directly to the vacuum process from the peak zones. Another innovative feature, the system is
optionally equipped with a second pyrolysis. The pyrolyses are installed under the inlet and outlet area. This makes effective residue management pos- sible. Material residues are reliably removed from the system. The first pyrolysis removes the process gas from the pre-heating zones, the second the gas from the peak zones. The degree of cleaning is sub- stantially higher and the process chamber remains
clean and dry, keeping maintenance to a minimum. Contact: Rehm Thermal Systems, LLC, 3080
Northfield Place, Suite 109, Roswell, GA 30076 % 770-442-8911 Web:
www.rehm-group.com
See at Nepcon South China Booth #C1N68.
New power module.
venting the control side from being interfered with by the busses dV/dt. The MOSFETs have an nonsymmet- ric driving voltage of +20/-4VDC designed for SiC devices, reducing the switching loss. The high capaci- tive load ensures instantaneous high power driving and high frequency operation. The operating tempera- ture of –40 to +105°C meets most of
the environmental requirements. Contact: Mornsun America,
LLC, 13 Country Club Lane, Suite
C, Milford, MA 01757 % 978-567-9610, 978-293-3923 E-mail:
sales@mornsungamerica.com Web:
www.mornsungamerica.com
See at NEPCON South China, Booth A-1G45
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