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tech.com
Abreath offresh air in gross leak testing
August, 2015
ClassOne Technology Intros Cost-Effective Plating Solution
Kalispell, MT — Semiconductor equipment manufacturer ClassOne Technology has introduced a configu- ration for optimizing Through Silicon Via (TSV) and Through Wafer Via (TWV) processes on its affordable Solstice®
electroplating systems. The Solstice family, introduced
No more helium, fluorocarbons, or radioactive gases. Norcom 410 finds gross leaks fast with air pressure alone.
Fast, simple, clean and safe, the NorCom 410 is the all-electronic alternative to bubble leak testing. In seconds, it accurately detects open packages and gross leaks. In minutes, it reports actual leak rates. All without consumables, radioactive gases, or pollutants.
Call for a demonstration on your metal, ceramic, silcone, or glass-lidded devices and discover a fresh approach to leak testing.
610-592-0167
www.norcomsystemsinc.com
1055West Germantown Pike Norristown, PA 19403 USA
last year, is designed to provide ad- vanced yet cost- effective plating for MEMS, Sensors, RF, Interposers and other emerging technologies for 200mm or smaller wafers. Flexi- bly configurable, the Solstice for TSV/TWV combines chambers for the critical blind via pre-wet operation with advanced copper plating on the robust and reli- able automation frame that is the heart of the Solstice. According to the company,
customer requests for TWV, whether alone or in combination with forming redistribution lay- ers (RDL), have skyrocketed. Many of the company’s smaller- wafer customers seek the advan- tages of 2.5 and 3D packaging needed for their next-generation products, and cost-effective TSV or TWV processing is mission- critical. The new Solstice configuration ad- dresses these needs effectively and elegantly with a plating tool that is affordably priced for 200mm and smaller substrates. The new Solstice TSV configu-
ration, which has already been sold to customers, employs a special, high-efficiency but simple vacuum pre- wet chamber followed by copper
via electroplating. This combination of capabilities enables the ClassOne tool to routinely produce fully-filled or lined vias with widths ranging from 5 to 250µ having aspect ratios as high as 9:1. Traditionally, this level of performance has been chal- lenging even for plating systems costing twice as much. The Solstice can also be config-
ured to perform additional down- stream processing such as resist
Solstice plating system.
strip and seed layer etch, making it a cluster tool that delivers a suite of critical processes, reducing cycle time and saving money. This technol- ogy makes it possible to process TSV alone or TSV and redistribution lay- ers simultaneously to provide a com-
plete solution on a single tool. Contact: ClassOne Technology,
Inc., 109 Cooperative Way #101, Kalispell, MT 59901 % 406-755-2200 E-mail:
info@classone.com Web:
http://classone.com
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