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hi-TeCh evenTS
www.us-
tech.com SMTA International to Have 3 Keynoters
Edina, MN — SMTA International’s keynote address will be given by Rozalia Beica, Chief Technology Officer with Yole Developpement, Lyon, France (
www.yole.fr), who will share the industry’s 3D technology trends and implications for assembly and manufacturing. This keynote address is scheduled for Tuesday, September 29, and will run from 8:00 am to 10:00 am. SMTAI will take place Sept. 28 - Oct. 1 at the Donald E. Stephens Convention Center, Rosemont, IL. The semiconductor industry
continues to be driven by miniatur- ization, increased performance and functionality as well as further reduction in cost. If leaded packages
were, for many years, the primary package of choice, the industry has now evolved to the point where there is now a wide range of different pack- aging technologies, including verti- cally integrated devices. Significant developments have been made in fur- ther reducing the pitch size and thickness of both silicon device as well as organic substrates (PCB and IC substrates) to enable a larger number of I/Os, shorter connections, therefore faster speeds within small- er and lower profile products. However, these miniaturization
trends have raised several chal- lenges, for handling and assembling such devices and substrates. Warpage, higher stresses, sol-
PhillyPACK and 5 Co-Located Shows, Oct. 7-8 in Philadelphia
Santa Monica, CA — This October, event producer UBM Canon will be launching a new line-up of co-located advanced manufacturing trade shows in Philadelphia. The trade shows will cover an
array of industry topics, with a spe- cific focus on Philadelphia’s dynamic industrial market. Educational con- ference sessions will delve into inno- vation in medical design, medical materials and polymers, packaging design, 3D printing innovations, and a user-centered product development workshop. These events will take place
October 7 - 8 at the Pennsylvania Convention Center in Philadelphia.
This new lineup of trade shows will include MD&M Philadelphia (Med ical Design & Manufacturing), Philly Pack (packaging), Design & Manufacturing Philadelphia (product design and manufacturing for all industries), ATX Philadelphia (auto mation), PLASTEC Philadelphia (for the plas- tics industry), and Quality Expo (quality control and assurance). The co-located events will all be held at the Pennsylvania Convention Center in downtown Philadelphia. Contact: UBM Canon, 2901 28th
Street, Suite 100, Santa Monica, CA 90405 % 310-445-4200 Web:
www.UBMcanon.com or
www.ubm.io/2015CanonPhilly
2015 EDITOrIAL CALENDAr ISSUE Jan/Feb March April/May EDITORIAL
Assembly & Packaging ATX West/MDM PP APEX PP
Test & Measurement
SMT & Production Nepcon China PP SMT/Hybrid/PKG PP EDS PP
June July August
Components & Distribution Atlantic Design PP Test & Assembly
Semicon West/Intersolar PP
Production & Packaging Nepcon South China PP
September PCB & Test SMTAI PP PCB West PP ATX Phila PP
October
SMT & Asswmbly Productronica PP MDM Minneapolis PP
Nepcon South China
WESTEC PCB West SMTAI ATX Philadelphia
IMAPS
The Assembly SOUT-TEC Autotest
MDM Minneapolis FABTEC Productronica
Nov/Dec
Components & Distribution ATX West/MDM PP
PP= Product Preview ATX West/MDM PP 8/25 - 8/27
9/15 - 9/17 9/22 - 9/24 9/28 - 10/1 /
10/27 - 10/29 10/27 - 10/29 10/27 - 10/29 11/2 - 11/5 11/4 - 11/5 11/10 - 11/12 11/10 - 11/13 2/12 - 2/14
Shenzhen, China
Los Angeles, CA Santa Clara, CA Rosemont, IL
Orlando, FL Rosemont, IL Charlotte, NC Washington, DC Minneapolis, MN Chicago, IL
Munich, Germany Anaheim, CA
SHOW DesignCon
ATX West/MDM APEX APEC
Nepcon China SMT/Hybrid/PKG
Electronics New England EDS
EASTEC
Wire Processing Tech Atlantic Design/MDM
Semicon West/Intersolar DATE
1/27 - 1/29 2/10 - 2/12 2/24 - 2/26 3/17 - 3/19
4/21 - 4/23 5/5 - 5/7 5/6 - 5/7 5/12 - 5/14 5/12 - 5/14 5/13 - 5/14
6/9 - 6/11 7/14 - 7/16 LOCATION
Santa Clara, CA Anaheim, CA San Diego, CA Charlotte, NC
Shanghai, China Nuremberg, Germany Boston, MA Las Vegas, NV Milwaukee, WI
New York, NY San Francisco, CA
der defects, tighter accuracies, con- tamination, higher cost due to more challenging processes, are some of the major challenges that industry has to address. Warpage, higher stresses, sol-
der defects, tighter accuracies, con- tamination, higher cost due to more challenging processes, are some of the major challenges that industry has to address. The presentation will provide
an overview of the packaging tech- nologies, highlighting the miniatur- ization trends and future roadmaps. Impact of new packaging technolo- gies on assembly needs and rework, highlighting new advancements in materials and equipment as well as assembly and manufacturing pro - cesses needed to address these chal- lenges will be presented.
Rozalia has 24 years of experi-
ence across various industries, from industrial to electronics and semicon- ductors. For more than 17 years, she was involved in the research, applica- tion and strategic marketing of Advanced Packaging and 3D Inter - nsibilities at specialty materials (Rohm and Haas Electronic Mater - ials), equipment (Semitool, Ap plied Materials, Lam Research), device manufacturing (Maxim IC) and OEM (NCR) organizations. In 2013 she joined Yole Developpement to lead and further grow the Ad vanced Packaging and Semicon ductor Manufacturing activities with in Yole. Another keynote, “Wearable
Tech nology: The Next Manufactur - ing Wave,” will be delivered by Murad Kurwa, of Flextronics Inter -
Continued on next page
Trade Show Calendar MORE SHOWS:
www.topline.tv/tradeshows.cfm
Aug. 25-27, Nepcon South China.*Shenzhen Convention & Exhibition Center, Shenzhen, China. Contact: Reed Exhibitions China, 1-3 Xinyuan South Road, Chaoyang
District, Beijing, Ping An International Finance Center A, Floor 15, China 100027 % +86-10-5933 9346 fax: +86-10-5933 9333 E-mail:
inquiry@reedexpo.com.cn Web:
www.reedexpo.com.cn or
www.nepconsouthchina.com
Sep. 9-11, International Drone Conference and Exposition.*The Rio, Las Vegas, NV.
Contact: BZ Media LLC, 225 BroadHollow Road, Ste. 211E, Melville, NY 11747 % 631-421-4158 Web:
www.interdrone.com
Sep. 15, IEEE SA/ICAP Symposium on Conformity Assessment.*St. Louis Convention Center, St. Louis, MO. Web:
http://standards.ieee.org/about/icap/about.html
Sep. 15-18, IEEE AUTOTEST (formerly Autotestcon). *America Center Convention Complex, St. Louis, MO. Info:
www.ieee-autotest.com
Sep. 29-Oct. 1, SMTA International.*Donald E. Stephens Convention Center, Rosemont, IL. Contact: SMTA, 5200 Willson Rd., Suite 215, Edina, MN 55424 952-920-7682 fax: 952-926-1819 Web:
www.smta.org
Oct. 6-8, Wisconsin Manufacturing & Technology Show.*Exposition Center, Wisconsin State Fair Park, Milwaukee, WI. Contact: The Wisconsin Manufacturing &
Technology Show, c/o Expo Productions, Inc., 510 Hartbrook Drive, Hartland, WI 53029 % 262-367-5500 Web:
epishows.com/wmtsg
Oct. 7-8, Pilly PACK, MD&M, etc.*Pennsylvania Convention Center, Philadelphia, PA. Contact: UBM Canon, 2901 28th Street, Suite 100, Santa Monica, CA 90405 % 310-445-4200 Web:
www.UBMcanon.com or
www.ubm.io/2015CanonPhilly
Oct. 13-15, International Wafer-Level Packaging Conference (IWLPC).*DoubleTree Hotel, San Jose, CA. Contact: SMTA, 5200 Willson Rd., Suite 215, Edina, MN 55424 952-920- 7682 fax: 952-926-1819 Web:
www.smta.org or
www.iwlpc.com
Oct. 27-29, IMAPS 2015. *Rosen Centre Hotel, Orlando, Florida. Contact: IMAPS, PO Box 110127, Research Triangle Park, NC 27709-5127 % 919-293-5000 fax: 919-287-2339 Web:
www.imaps.org/imaps2015
Oct. 27-29, The Assembly Show.*Donald E. Stephens Convention Center, Rosemont, IL. Contact:
www.theassemblyshow.com
Nov. 2-5, IEEE AUTOTEST. *Gaylord National Resort & Convention Center, National Harbor, MD. Info:
www.autotestcon.com or Conference Catalysts, 802 NW 16th Ave., Ste. B, Gainesville, FL 32601 % 352-872-5544 E-mail:
cdyer@conferencecatalysts.com Web:
www.conferencecatalysts.com
Nov. 10-11, The Great Miniaturization: Systems and Packaging Symposium (MEPTEC and SEMI).*Biltmore Hotel, Santa Clara, CA. Contact:
www.meptec.org
Nov. 10-13, productronica.*New Munich Trade Fair Centre, Munich, Germany. Contact: Munich Trade Fairs, 75 Broad St., 21 Floor, New York, NY 10004 % 646-437-1014 Web:
www.munichtradefairs.com or
www.productronica.com
Dec. 2-4, International Printed Circuit and APEX South China Fair.*Shenzhen Convention and Exhibition center, Shenzhen, China. Contact: IPC % 877-472-4724 or 847-597-2860 (outside U.S. & Canada) Web:
ipc.org or
www.hkpca-ipc-show.org
Jan. 6-9, 2016, International CES. *Las Vegas Convention Center and other convention spaces, Las Vegas, NV. Contact: Consumer Electronics Association, 1919 S. Eads St., Arlington, VA 22202 % 866-233-7968 Web:
www.CE.org or
www.cesweb.org
August, 2015
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