When applied to AlN for GaN device applications, PVDNC produces a unique ensemble of highly oriented, highly perfect, AlN nanocolumns that together present an optimal surface for GaN nucleation.
M/A-COM Technology Solutions, Inc
X-Band Core Chip (MAMF-011015)
M/A-COM Technology Solutions Inc. claims an industry first with an integrated core chip for the 8 GHz – 11 GHz frequency range. Containing 6-bits of phase control, 6-bits of attenuation control and 26 dB of gain, the Core Chip is an easy to use serial/parallel interface in a surface mount QFN package. Ideal for commercial radar applications, this integrated MMIC enables radar systems in early detection and warning for severe impending weather.
The X-Band Core Chip (MAMF-011015) is a highly integrated solution setting new standards for size, weight, and performance (SWaP) enabling the next generation of radar system design. The X-Band Core Chip integrates a CMOS logic driver with a GaAs Transmit/ Receive MMIC within a single QFN package. The surface mount 7x7mm plastic package offers a cost-effective, easy to implement solution. The device’s versatility and flexibility make it ideal for weather, wildfire and related commercial radar applications.
The X-Band Core Chip development is a product of a joint investment between MACOM and FIRST RF Corporation to support new weather radar programs such as the Collaborative Adaptive Sensing of the Atmosphere (CASA) Weather Radar Program. CASA is a multi- sector partnership among academia, industry, and government - dedicated to engineering revolutionary weather- sensing networks. These innovative networks save lives and property by detecting the region of the lower
March 2014
www.compoundsemiconductor.net 73
atmosphere currently below conventional radar range - mapping storms, winds, rain, temperature, humidity, and the flow of airborne hazards.
The packaged device comprises of a common leg circuit which includes digital attenuators, phase shifters, a low noise
receive chain, and a transmit driver amplifier, as well as a CMOS logic driver. This integrated circuit utilizes MACOM’s advanced 0.25um PHEMT process, which has been optimized for high power and low noise amplifiers, passive and control components and allows for a high level of integration on a single MMIC.
Winners review will appear in the next issue of Compound Semiconductor
www.compoundsemiconductor.net
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