Equipment and Materials ♦ news digest
Technology’s microspectrophotometers and their controlling Lambdafire software. Craic FilmPro allows the user to measure the thickness of thin films rapidly and non-destructively.
Able to analyse films of many materials on both transparent and opaque substrates, Craic FilmPro enables the user to determine thin film thickness on everything from semiconductors, MEMS devices, disk drives to flat panel displays. The software can be used in many different fields and in everything from research to industrial settings.
With the addition of spectral mapping from Craic Technologies, the firm says film thickness maps of entire devices can be created.
Rudolph reports record installations for semiconductor software Increasing demand for productivity information has been
driven by needs for better yields in LEDs and compound semiconductor manufacturing
Rudolph Technologies says it has completed record installations in Q4 2013 of its fab-wide yield management software (YMS) products, Discover Enterprise and Genesis Enterprise.
These packages are used by semiconductor manufacturers to obtain process yield and equipment productivity information.
Film Thickness Mapping
“Many of our customers want to measure the thickness of thin films of smaller and smaller sampling areas for rapid quality control of their products. Craic FilmPro is a plug- in module that can be added to a Craic Technologies microspectrophotometer to enable this capability. This software was built in response to customer requests for a powerful, flexible film thickness tool that can measure sub-micron areas on both transparent and opaque
substrates.Craic Technologies microspectrophotometers equipped with Craic FilmPro meets those needs” says Paul Martin, President.
The complete Craic Technologies microspot film thickness solution combines an advanced microspectrophotometer with the sophisticated Craic FilmPro software. This software is a plug-in module to Craic Technologies Lambdafire instrument control software.
It enables the user to measure film thickness by either transmission or reflectance of many types of materials and substrates.
Due to the flexibility of the Craic Technologies design, sampling areas can range from over 100 microns across to less than a micron. Designed for both research and the production environment, it incorporates a number of easily modified processing recipes, the ability to create new film recipes and sophisticated tools for analysing data.
In addition to traditional semiconductor manufacturing, Discover Enterprise Software was installed at a multi- billion dollar OEM in multiple labs, replacing the incumbent technology.
Rudolph attributes the rise in adoption to the industry’s growing need for productivity data as it seeks to increase the yields of new, increasingly complex manufacturing processes.
The data necessary to generate productivity information comes from many different sources throughout the fab: inspection and metrology systems, tool sensors, tool recipes, electrical tests, and the fab environment.
As the complexity and cost of manufacturing processes increase, the value of faster, better analysis to support critical manufacturing decisions grows too, so customers are demanding robust yield management systems that can analyse large, complex data sets quickly and effectively.
Rudolph’s fully-integrated YMS solutions are designed to analyse data from disparate sources and multiple sites to maximise productivity across the entire value chain.
“Improving quality and yield as well as tool productivity were the paramount reasons we selected Rudolph’s YMS solutions,” says Philip O’Leary, Six Sigma Master Black Belt, Murata Electronics Oy, a designer and manufacturer of silicon capacitive sensors: accelerometers, gyroscopes, combined sensors and inclinometres.
March 2014
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