Compound Semiconductor Manufacturing Award
DAS Environmental Expert GmbH
LARCH
LARCH is a Point-of-Use waste gas treatment system especially designed for MOCVD processes. It is capable of treating large flows of Hydrogen and Ammonia as well as small flows of metal- organics and dopants, which are typically found in common LED processes. Low investment and operating costs, simple, robust design and low environmental impact (no CO2 emissions, minimum NOx emission) characterize LARCH. The maintenance interval is expected to exceed six months. The system operates in three steps.
First, the process waste gases are introduced through a special packed inlet into the decomposition zone. There decomposition of Ammonia (2NH3= N2 +3H2) takes place. Following the Hydrogen is electrically ignited and oxidized. The waste gases are burned and oxidized within the reactor (2H2 + O2 = 2H2O). Finally the waste gases are cooled (< 60 °C), which can be released into the environment without any further treatment as they meet the strict German standards for air pollution (TA Luft).
Advantages include: No CO2 emissions: no greenhouse gases, low NOx emissions, no wastewater: no trouble with NH4+wastewater limits, treatment of H2 at the Point-of-Use, maximum security regarding H2, Simple and robust design: low investment costs, low CoO, low maintenance, internal security: H2 dilution in case of fire.
Veeco Instruments, Inc GENxplor MBE Deposition System
The GENxplor is a revolutionary new molecular beam epitaxy (MBE) deposition system specifically developed
March 2014
www.compoundsemiconductor.net 65
to address the needs of university-based compound semiconductor researchers. Starting from a completely new, innovative architectural concept, the GENxplor system records a number of industry firsts. The GENxplor is the first MBE system of its size to package all elements into a single platform. Combining the growth/process chamber,
buffer chamber, load-lock chamber, and the electronics and controls into a single monolithic frame reduces its footprint by 40% compared to similar MBE systems.
The flexible system platform is capable of growing on up to 3” wafers with a wider variety of compound semiconductor materials than ever before including:
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