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Front Ends for Mobile Devices


Handset front-ends are becoming more complex, due to an ever-increasing number of bands used for mobile communication. Will this trend play into the hands of GaAs chipmakers? Or is silicon CMOS technology going to grab market share?


Keynote presentation: Jeremy Hendy Envelope tracking - transforming the performance of CMOS and GaAs PAs


Eric Higham Coming full circle - will Si CMOS burst the GaAs bubble?


Thomas Meier GaAs & Silicon: Co-existence in a wireless world


Brendan Timmins Minimizing the cost of precious metals used in compound semiconductors


Dirk Schumann Waterbased stripping innovation for wafer stripping and metal lift-off


Cris Kroneberger Non contact magnetic drive assembly for improved reliability and reduced particulates


Lasers, PICs and PV


Rocketing levels of internet traffic are putting greater and greater strain on optical networks and data centres. Can this be addressed by advancing the performance of conventional lasers, or does the market need to turn to greater use of PICs?


Keynote presentation: Michael Lebby Photonic integration in InP: A regrowth-free platform for the fabless manufacturing model


Michael Vyvoda Using proton induced exfoliation to manufacture low-cost, device quality single crystal substrates


Gregory Fish III-V heterogeneous photonic and electronic integration on silicon


Petteri Uusimaa RGB laser solutions to display and projection application


Hong Lin Bulk and free-standing GaN substrate technologies and industry status in the LED, laser diode and power applications


Rainer Krause - Soitec Wafer bonded 4-junction GaInP/GaAs//GaInAsP/ GaInAs high performing concentrator solar cells


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