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NEWS REVIEW


TriQuint combines GaAs and silicon to accelerate global mobile growth


TRIQUINT has unveiled three new highly integrated multi-mode, multi-band power amplifi er modules (MMPAs) that are claimed to deliver longer battery life for LTE smartphones and mobile devices while simplifying increasingly complex RF design.


The fi rm’s MMPAs use both silicon and GaAs technology. The combination of the technologies is more effi cient in terms of design and infrastructure than its current silicon competitor, silicon CMOS.


While silicon CMOS is gaining traction at the lower end of the market in 2G and lower 3G mobile devices, the technology does not provide adequate support across all radio frequency bands. These versatile new products – which are already capturing design wins in leading LTE smartphones support envelope tracking for higher power effi ciency, 0MIPI interface for design fl exibility.


“Building on the success of TriQuint’s highly integrated TRIUM MMPAs, our three newest products add more LTE bands to cover more regional markets, as well as support for power-saving envelope tracking and a versatile new MIPI interface,” explains Sean Riley, Vice President of Mobile Products. Device manufacturers are adopting


envelope tracking (ET) in next-generation smartphones to maximise energy effi ciency. ET extends battery life by dynamically adjusting the supply voltage to the power amplifi er (PA), in contrast to PAs with conventional constant-supply voltage.


TriQuint’s new MMPAs also feature a new mobile chip interface - based on an open “MIPI” standard - used by several chipset providers to increase interoperability among vendors and reduce development time and effort.


In addition to designing more sophisticated devices, manufacturers serving the global market must produce several regional variants of each model to operate in carriers’ specifi c assigned spectrum. This is more challenging as numerous new LTE bands are allocated.


The design of TriQuint‘s new MMPAs gives manufacturers a common platform to release new products at a faster pace, while controlling design and manufacturing costs. They support a growing number of popular 3G/4G bands for specifi c regions as well as quad- band GSM/EDGE. By integrating more functionality into smaller form factors, they simplify PCB routing, reduce BOM count and speed time to market.


Seoul Semi breaks the one trillion Korean won sales mark in 2013


LED chipmaker Seoul Semiconductor has achieved the company’s greatest sales revenue,1.0321 trillion Korean won (US $973 million) and an operating profi t of 965 hundred million Korean won in 2013.


In comparison to 2012, sales increased by 20 percent and the operating profi t by 190 percent. Seoul Semiconductor has increased sales by focusing on Acrich2 LED modules which the company says is the world’s fi rst Alternating Current drive, and steady selling products such as mid- power and high-power packaged LEDs.


Applying the patented Black Hole Lens technology to direct-type LED for TV in the IT sector, Seoul Semiconductor has increased IT related sales. In addition, the sales of tablet PC related products are also the tangible results of its rise in the market.


After being listed on the Korea Stock Market (KOSDAQ) in 2002, another contributing factor to reach one trillion Korean won in sales after 12 years was the establishment of its patent portfolio that consists of more than 11,000 patents. Investing approximately 10 percent of its sales revenue each year in LED product research, development and registering over 600 patents in a year, the company holds world-class competitive patents.


10 www.compoundsemiconductor.net March 2014


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