RF Electronics ♦ news digest leaders will be named later this year.
The transaction is expected to close in the second half of calendar 2014 subject to approval by the shareholders of both companies, the receipt of regulatory approvals, and other customary closing conditions.
BofA Merrill Lynch is acting as exclusive financial advisor to RFMD. Goldman Sachs is acting as exclusive financial advisor to TriQuint. Perkins Coie is acting as counsel for TriQuint and Weil, Gotshal & Manges LLP and Womble Carlyle Sandridge & Rice, LLP are acting as counsel for RFMD.
Conference Call and Webcast Information
RFMD and TriQuint will host a conference call today that begins at 8:30 a.m. EST/5:30 a.m. PST. A live webcast of the conference call, as well as a related slide presentation, can be accessed at
ir.rfmd.com or at invest.
triquint.com. The call can also be accessed live over the phone by dialing 1-480-629-9866, access code 4671275.
Can RFaxis` silicon FEM devices kick GaAs?
Yes it can, according to Frost & Sullivan. The market research firm says RFaxis’ cost effective technology is helping wireless devices achieve performance and quality that is comparable to a wired network
Based on its recent analysis of the market for radio frequency front-end module (RF FEM) solution for wireless communication, Frost & Sullivan honoured RFaxis, Inc. with the ‘2014 North American Frost & Sullivan Award for Technology Innovation Leadership’.
RFaxis leveraged its single-chip/single-die RF Front-end Integrated Circuit (RFeIC) architecture to develop unique RF front-end solutions for wireless communications.
These innovative solutions, which combine superior performance capabilities with affordability, also prove to be ideal alternatives to conventional gallium arsenide (GaAs) solutions.
RF front-end solutions are traditionally built by embedding active and passive multiple components on a substrate using GaAs. The hybrid integration of passive and active compounds forms a multi-chip RF FEM, resulting in a large package size and bigger footprint on the printed circuit board (PCB).
However, with the semiconductor industry for wireless communication moving from bulky, multiple integrated
“Apart from reducing the time to design and market, RF front-end level of integration offers device manufacturers a very simple solution that can be implemented as a plug and play,” says Frost & Sullivan Sr. Research Analyst Swapnadeep Nayak. “RFaxis’ technology helps OEMs reduce their product development cycles to as low as a few weeks, while competing solutions take months. It satisfies every performance criterion set forth by component manufacturers and original equipment manufacturers (OEMs).”
F&S says that unlike CMOS, GaAs is a niche domain, which does not have adequate foundry capacity to meet the global demand from the semiconductor industry and OEMs. Migrating to CMOS technology lowers the strain on the supply chain, which helps device manufacturers cope with demands from the industry.
RFaxis’ technology offers substantial price reduction in comparison to incumbent solutions. It also helps system-on-chip (SoC) vendors and OEMs integrate the company’s solutions with other modules.
The comparison of all RF Front-end solutions shows that RFaxis is among the few participants that integrate the key RF front-end components of power amplifiers, low noise amplifiers, and switches into a CMOS SoC.
Such a high degree of integration has a direct bearing on RF front-end innovations for the wireless local area network (WLAN), long term evolution (LTE/4G), and Machine-To-Machine communications markets.
RFaxis’ technology powers a wide range of application segments that use wireless communication as a key platform, the main ones being broadband (gateways, set- top boxes, video streaming applications), mobile devices (smartphones), and the Internet of things (IoT).
RFaxis is also looking at the smart TV and remote control segments to transform them from mere devices to gadgets that perform functions, such as music and video streaming.
March 2014
www.compoundsemiconductor.net 111
chips to leaner, single chips, RFaxis’ RFeIC solutions are gaining prominence for being highly integrated on a single silicon-based chip.
Frost & Sullivan’s research indicates that RFaxis has succeeded in developing the world’s first single-chip/ single-die integrated circuit architecture based purely on standard complementary metal oxide semiconductor (CMOS) technology.
And the firm syas its quality and performance are comparable with GaAs-based RF front-end solutions, while its cost structure, thermal conductivity and ruggedness are far superior.
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