July, 2012
www.us-tech.com
Page 77 Henkel Chipbonder for Non-Contact Dispensing
Irvine, CA — Henkel’s expansive portfolio of Chipbonder brand adhe- sives SMAs is LOCTITE 3621, which has been validated for use with non- contact dispensing — often referred to as jetting — technologies. This capability makes the SMA even bet- ter for high-volume production envi- ronments. The majority of SMAs are nee-
dle-dispensed which, although ade- quate for many applications, does have limitations in terms of speed, as well as dot shape and size. LOCTITE 3621’s unusual rheology makes it well-suited for non-contact dispens- ing processes, which helps alleviate some of the drawbacks with tradi- tional needle dispensing. Using this product, non-contact dispense speed is nearly four times faster as com- pared to needle dispense techniques. With a small dot size — 350µ (0.014- in. — and larger), dots per hour (DPH) of up to 40,000 can be achieved with non-contact dispens- ing as compared to an average of 10,000 DPH with alternative meth- ods. In addition to its sheer speed advantage, the non-contact dispens- ing SMA also provides for more uni- form dot dimensions and volume repeatability. Needle dispense tech- niques are often prone to tailing or stringing, which can result in con- tamination of the solder pads and,
from ConTech Concord, CA — ConTech, a Division of Calex, has introduced the “TMH” Series of DC/DC converters, which offer up to 40 Watts of fully regulat- ed output power with an industry standard 2 x 1-in. (50.8 x 25.4mm) footprint. The units are encapsulated with a thermally conductive potting compound in a six-sided metal case for improved thermal performance in still air environments, and are RoHS-compliant. The converters provide a 2:1
input range with nominal input volt- ages of 12, 24, and 48VDC. Single outputs offered are 3.3, 5, 12, and
40Watt DC/DC Converter
ultimately, a poor interconnect. The non-contact dispensed material elim-
inates this concern, as there is no tailing or stringing, dot dimensions
are more spherical and dot-to-dot consistency is far better as compared to alternative deposition methods. Other notable advantages include the material’s lead-free wave com- patibility, excellent green (wet) strength, fast cure capability of 120 seconds at 150°C and long shelf life of one month at room temperature and ten months under refrigerated
storage conditions. Contact: Henkel Corp., 1400
Jamboree Rd., , Irvine, CA 92606 % 714-368-8000 949-789-2500
fax: 714-368-2265 E-mail:
doug.dixon@us.henkel.com Web:
www.henkel.com/electronics
Chipbonder adhesive under small chips.
See at Semicon West Booth #5981.
DC/DC converters.
15VDC. Dual outputs are ±12 and ±15VDC. The converters operate with efficiencies as high as 92 per- cent. Features include Remote On/Off, Output Trim, and Short Circuit Protection. The operating ambient temperature range is % 40 to +55°C with no derating. The non- derated temperature range can be extended to +65°C ambient with an
optional heat sink. Contact: ConTech/Calex Mfg. Co., Inc., 2401 Stanwell Dr.,
Concord, CA 94520-4841 % 800-542-3355 or 925-687-4411 E-mail:
sales@ConTech-us.com Web:
www.ConTech-us.com
See us at Semicon West / Intersolar, Booth 5971
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