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Haverhill, MA — DKN Research has introduced thin and light connection devices for fine flexible circuits. The


www.us-tech.com


new UTF Connector FTF Series was developed for small pitch connections between high density flexible circuits.


It provides a wider range of design flexibilities for packaging and termi- nation in portable electronic prod- ucts.


The growing demand for smaller


and more powerful portable electron- ics has fueled the evolution for these products. DKN Research teamed up with Hirai Seimitsu Kogyo, a special- ty component manufacturer in Osaka Japan, and co-developed a new con- nection device using that company’s special chemical etching technologies. The UTF Connector FTF Series will now allow fine pitch connections be- tween high density flexible circuits. The basic mechanism from the FTF Series was created by upgrading the design concept of the current UTF Connectors that were developed for connections between flex circuits and rigid circuit boards. The micro-sized bump array


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generates a uniform pressure for the contact pad array between two flexi- ble circuits facing each other, and al- lows electrical connections between the pads formed on the flexible cir- cuits. The connection pitch can be below 0.5mm, and the total thickness of the connection can be less than 1.0mm. The small weight of the con- nectors means that no additional de- vices are required to fix them. In ad- dition, the connectors are not too heavy for the fragile thin flexible cir- cuits. The connections can be com- pleted with simple alignment tools; no special expensive application ma- chines are required. The FTF Series can be used in a


July, 2012 DKN Research: Thin & Light Fine Pitch Connector


broad range of applications such as a repeated connection type, a perma- nent connection type or a semi-per- manent type designed for different


Ultra-micro etched flex connector.


connection purposes. The unique etching process assures the design variations are easy to produce at a very low cost. This is extremely ad- vantageous for customers interested in trial and error processes. The new connectors are custom-


made based on customer require- ments. The chemical etching process allows a broad range of capabilities, from prototype to volume production. This flexibility is possible because the process does not need expensive molding or punching dies. The cus- tomers are able to change the circuit designs in a short time without big


tooling costs. Contact: DKN Research LLC,


62 Adams St., Haverhill, MA 01830- 6862 % 978-436-1417 E-mail: sales@dknresearch.com Web: www.dknresearch.com


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Haverhill, MA — APEM Compo- nents, Inc. is introducing its IM Se- ries sealed snap-action pushbutton switch. This pushbutton has a 12mm diameter bushing with a round actu- ator. The IM series offers tactile snap-action feel that is different from


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   


      


Certified ITAR Complete Wafer Level Backend Services High-Speed Die Sorting


    


ISO 9000 Certified


High-Speed Solder Jetting  


 





High-Accuracy Wafer Dicing       


Low-Stress Wafer Thinning    


 


Visit us at SemiconWest Booth 519 South Hall


 www.pactech.com See us at Semicon West / Intersolar, Booth 519


Snap-action pushbutton switches.


cludes; Snap-action mechanism: au- dible tactile feedback, high voltage rating, Matching the “I” range de- sign, 12mm diameter bushing, round actuator, light plastic case, two bezel diameters (standard 17mm, reduced 15mm), and sealed to IP67, and me-


chanical lifetime of 1 million cycles. Contact: APEM Components,


Inc., 63 Neck Road, Haverhill, MA 01835 % 978-372-1602 fax: 978-372-3534 or 978-372-9516 E-mail: info@apem.com Web: www.apem.com


its predecessor, the IP Series. With its strong and audible tac-


tile feedback, the IM series comple- ments and extends the “I” range of sealed pushbutton switches. It is es- pecially suitable for harsh, noisy en- vironments, including those involv- ing vibration, where the use of a sealed switch with a confirming “click” is imperative. Optionally available with a reduced bezel, the IM series fits into the tightest spaces. The switches are excellent for agri- culture, military vehicles, and crane remote controls markets. The IM pushbutton series in-


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