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www.us-tech.com
July, 2012
Ultrasonic Systems Adds Coating System Options
Haverhill, MA —Ultrasonic Systems, Inc. (USI) has developed new options for its MAX-800 coating system to accommodate the expanding list of customer coating requirements. The new system leverages the company’s proprietary, nozzle-less ultrasonic spray head technology for the thin, uniform application of a variety of coatings used in display manufactur- ing, fuel cell manufacturing, battery manufacturing, solar cell manufac- turing and medical device manufac- turing processes. The MAX-800 incorporates a
high-speed, fully programmable X-Y- Z gantry and a large, usable spray area of up to 780 x 780mm (30 x 30- in.). New options for the system include application-specific sized heated substrate fixture with vacu- um hold, a heavy-duty conveyor for large substrates and pallets, an auto- mated reel-to-reel system for coating foil substrates, and a walking beam conveyor for transporting tablet com- puter sized glass plates. The optional active HEPA filtra-
tion system and vacuum purged actu- ators ensure class 100 clean room com-
patible conditions in the spray area. The company’s Precision Metering Pump liquid delivery system with servo motor control and automatic pump re-fill, delivers precise, repeat- able liquid flow to the spray head.
Ultrasonic coating system. Contact: Ultrasonic Systems,
Inc., 135 Ward Hill Ave., Haverhill, MA 01835 % 978-521-0095 E-mail:
rlepage@ultraspray.com Web:
www.ultraspray.com.
See at Semicon West Booth #6264.
Product Profile for EPCOS Pressure Sensor Dies
Iselin, NJ — TDK-EPC, a group com- pany of TDK Corporation, has pub- lished a new Product Profile that describes EPCOS brand Pressure Sensor Dies. Included are key technical
Prototron Circuits
America’s Board ShopTM Quickturn PCBs Since 1987
RoHS 5
parameters for the C27, C29, C32 and C33 sensor dies for absolute and gauge pressure measurement; sensor dies for the rear-side measurement of absolute pressure in wet media, including special versions with gold- bonded pads and gilded protection layers for better processing and greater media resistance; bond pad layout, circuit diagram and cross sec- tion of each sensor die. Also included are typical appli- cations and explanations of differen-
tial measurement principles and technical terms; conversion table for various pressure units; general infor- mation, technical data, dimensional drawings and ordering codes. “Product Profile 2012 Pressure
Sensor Dies” can be downloaded at
www.epcos.com/publications. In ad di - tion, data sheets can be downloaded under
www.epcos.com/pressure_sen- sors.
Contact: TDK-EPC, 485B Route 1 South, Suite 200,
Iselin, NJ 08830 % 800-888-7729 or 732-906-4395 Web:
www.usa.epcos.com or
www.epcos.com
See at Semicon West Booth #6747.
Prototron.com
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