This page contains a Flash digital edition of a book.
July, 2012


www.us-tech.com


Process Improvements in Fluid Dispensing Continued from previous page


expectancy, and alerts the operator when the cartridge needs replace- ment. Each cartridge lasts up to 50 million cycles, depending on the type


date a broader range of fluids and viscosities than previous jets, such as thick and elastic fluids. Tests have been completed successfully with flu- ids from a broad spectrum of fluid formulators.


Lower Cost of Ownership An added benefit of the new sys-


tem is a significant reduction in cost of ownership of about 20 percent. Part of the reduction is simply based on the long life of each cartridge and because a second cartridge comes with the sys- tem so a replacement is immediately available and there is no need to pur- chase a second jet. Other savings occur because of the fast installation and removal of the cartridge, minimized


touch-time for troubleshooting and cleaning, minimal training time, and simplified part stocking and re-order- ing frequency. There are also the sav- ings in time, money, labor, and the fac- tors that accompany cleaning a dis- pensing valve. Thousands of hours of testing


have been conducted on the system to date. Testing is continuing to be done with additional fluids and application parameters. Data is also being collected on the improvement in yield that results from a reduction in factors relating to the production set-up and change-over time derived from using the Genius Jet Cartridge. However, factors that affect yield include more than just time required


Page 53


for training, cleaning, assembly, and manufacturing. If a jet that has been put together incorrectly is put in pro- duction, there can be fluid leaks, incorrect dot sizes, and inaccurate placement. As electronics manufac- turers aim for faster time-to-market, reduced costs, and more emphasis on creating quality and brand equity, we will see the evolution of addition- al types of production equipment. Contact: Nordson ASYMTEK,


2762 Loker Ave. West, Carlsbad, CA 92010 % 800-279-6835 or 760-431-1919 fax: 760-431-2678 E-mail: info@nordsonasymtek.com Web: www.nordsonasymtek.com r


See at Semicon West Booth #6071.


 


NexJet System on stand.


of fluid used and the application. This translates to between a 1- and 3- month life in high volume production environments. If production rates are low, the jet cartridge can last for much longer. Incorporating RFID capabilities minimizes operator mis- takes, eliminates accidental usage and usage longer than recommended, prevents accidental use of incorrect parts, and allows process engineers to evaluate production history. With smaller devices and com-


ponents placed in tighter configura- tions, a challenge has been to main- tain speed, while increasing preci- sion, accuracy, and reliability — and to accomplish this with many fluid types that have a wide range of vis-


Fluid has to be dispensed so it is centered in the process window and dot sizes have to be controlled.


cosities. Fluid has to be dispensed so it is centered in the process window and dot sizes have to be controlled. Process tools and software have played a major role in fine-tuning and controlling the jetting process and the factors that make the process vulnerable to the variations that affect fluid jetting. Precision software developed for


the NexJet has increased jetting capabilities. Fluid ejection and jet dot velocities are adjusted, the process capability index (CpK) is improved, and satellites, accumula- tion, and splashing are reduced. A wide range of dot sizes are possible. Calibrated process jetting (CPJ) measures the fluid mass and calcu- lates the exact amount of fluid to dis- pense while compensating for fluid viscosity changes to maintain volu- metric repeatability during long pro- duction runs. The new system supports more


applications and fluids. Jetting ap - plications include flip chip underfill, chip scale package underfill, ball grid arrays, package-on-package under- fill, precise coating, and adhesive dis- pensing. The system can accommo-





 


               


          





 


 


    See us at Semicon West / Intersolar, Booth 6453    


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