search.noResults

search.searching

saml.title
dataCollection.invalidEmail
note.createNoteMessage

search.noResults

search.searching

orderForm.title

orderForm.productCode
orderForm.description
orderForm.quantity
orderForm.itemPrice
orderForm.price
orderForm.totalPrice
orderForm.deliveryDetails.billingAddress
orderForm.deliveryDetails.deliveryAddress
orderForm.noItems
Page 92


www.us - tech.com


September, 2021 High-Speed Flexible Cables from Yamaichi


SAN JOSE, CA — Conventional technologies such as flexible flat cables and flexible print- ed circuits (FFC/FPC) or micro-coaxial cables cannot cope with requirements for extremely high reliability and continuously increasing data transmission rates between internal printed circuit boards. Yamaichi Electronics has launched its Y-


FLEX cable technology to help solve this prob- lem. With the Y-FLEX high-speed FPC users can establish data rates of 56 Gb/s (PAM4) over a cable length of 3.9 in. (100 mm). The suitability of the Y-FLEX cable for


high data transmission rates is realized with characteristics such as LCP (liquid crystal polymer) as a base material, the contacting of


Y-FLEX high-speed flexible board-to-board cable.


various layers with so-called silver bumps and the special, 100 percent reproducible production process. In order to achieve par-


ticularly high transmission speeds, it is important to match the Y-FLEX specifically to the appropriate FFC/FPC connector. In principle, the Y-FLEX mating face can be adapted to any standard ZIF, non-ZIF or LIF connector. However, specially devel- oped highspeed ZIF or non-ZIF connectors such as the HF507 series from Yamaichi are designed to achieve the best performance. The biggest difference between Y-FLEX


and standard FPCs lies in the insulation material. Compared with the standard poly- imides used in conventional FPCs, the LCP insulation material in the Y-FLEX exhibits a much lower dielectric constant and a much lower dissipation factor at high frequencies. As a result, attenuation is much lower, and the data transmission rates are much higher than in standard FPCs. Also, LCP has superior hygroscopic properties compared with those of standard polyimide. Contact: Yamaichi


Electronics USA, 475 Holger Way, San Jose, CA 95134 % 408-715-9100 E-mail: info@yeu.com Web: www.yeu.com


INTERNATIONAL SYMPOSIUM on MICROELECTRONICS OCTOBER 11-14, 2021 • SAN DIEGO, CA • IMAPS2021.org


54th Conference:


October 12 - 14, 2021 Exhibition:


October 12 - 13, 2021


Professional Development Courses: October 11, 2021


SPONSOR & EXHIBIT SALES UNDERWAY!


PREMIER SPONSOR


Highest-exposure sponsorship package Includes a booth and exceponal visibility


TECH SPONSOR


Bundles high visibility event sponsorships with a booth and addional exposure


NETWORKING SPONSOR


Sole or co-sponsorship of a funcon Booth not included


SUPPORTING VIRTUAL PARTNER Sponsorship for those companies


unable to parcipate in-person at the Symposium


For sponsorship information, contact


Brian Schieman, Executive Director bschieman@imaps.org


IMAPS is consulting government agencies, event partners, and our stakeholders regarding the Covid-19 virus ahead of IMAPS 2021 San Diego. We will keep attendees informed of any effects to the event. IMAPS remains committed to delivering the best Symposium this Fall and anticipates a robust, healthy event for all of our attendees, speakers, and exhibitors. We are exploring all options for alternative conference plans including virtual presentation options and other online tools in the event that the in-person components of the Symposium are deemed unsafe or not possible and will be prepared to offer all in-person, virtual and/or blended meeting options for all.


The 54th International Symposium on Microelectronics, organized by the International Microelectronics Assembly and Packaging Society (IMAPS), will feature 5 technical tracks, plus an Interactive Poster Session that span the three days of sessions. Emphasis is on packaging technologies that serve 5G, High Performance Computations, Automotive, Industrial, Defense/Space, and Medical electronics markets.


• TRACK 1: Manufacturing Optimization


• TRACK 2: Wafer Level/Panel Level (Advanced RDL)


• TRACK 3: High Performance/High Reliability


• TRACK 4: Advanced Package (Flip Chip, 2.5D, 3D, Optical)


• TRACK 5: Advanced Process & Materials (Enabling Tech.) ROHM


IGBTs SANTA CLARA, CA — ROHM Semiconductor today announced its RGWxx65C series of hybrid IGBTs with an integrated 650V SiC Schottky barrier diode. The devices, qualified under


the AEC-Q101 automotive relia- bility standard, are ideal for automotive and industrial appli- cations that handle high power, such as photovoltaic power con- ditioners, onboard chargers, and DC/DC converters used in elec- tric and electrified vehicles (xEVs). The RGWxx65C series


(RGW60TS65CHR, RGW80T S6 5 - CHR, RGW00TS65CHR) utilizes ROHM’s low-loss SiC Schottky barrier diodes in the IGBT feed- back block as a freewheeling diode that has almost no recovery energy, thus minimal diode switching loss. Additionally, since the recovery current does not have to be handled by the IGBT in turn-on mode, IGBT turn-on loss is significantly reduced. Both effects together result


in up to 67 percent lower loss over conventional IGBTs and 24 percent lower loss compared with super junction MOSFETs (SJ MOSFETs) when used in vehicle chargers. Contact: ROHM Semicon -


ductor USA, 2323 Owen Street, Santa Clara, CA 95054 % 408-720-1900 E-mail:


jpontious@rohmsemiconductor.com Web:www.rohmsemiconductor.com


Introduces Hybrid


Page 1  |  Page 2  |  Page 3  |  Page 4  |  Page 5  |  Page 6  |  Page 7  |  Page 8  |  Page 9  |  Page 10  |  Page 11  |  Page 12  |  Page 13  |  Page 14  |  Page 15  |  Page 16  |  Page 17  |  Page 18  |  Page 19  |  Page 20  |  Page 21  |  Page 22  |  Page 23  |  Page 24  |  Page 25  |  Page 26  |  Page 27  |  Page 28  |  Page 29  |  Page 30  |  Page 31  |  Page 32  |  Page 33  |  Page 34  |  Page 35  |  Page 36  |  Page 37  |  Page 38  |  Page 39  |  Page 40  |  Page 41  |  Page 42  |  Page 43  |  Page 44  |  Page 45  |  Page 46  |  Page 47  |  Page 48  |  Page 49  |  Page 50  |  Page 51  |  Page 52  |  Page 53  |  Page 54  |  Page 55  |  Page 56  |  Page 57  |  Page 58  |  Page 59  |  Page 60  |  Page 61  |  Page 62  |  Page 63  |  Page 64  |  Page 65  |  Page 66  |  Page 67  |  Page 68  |  Page 69  |  Page 70  |  Page 71  |  Page 72  |  Page 73  |  Page 74  |  Page 75  |  Page 76  |  Page 77  |  Page 78  |  Page 79  |  Page 80  |  Page 81  |  Page 82  |  Page 83  |  Page 84  |  Page 85  |  Page 86  |  Page 87  |  Page 88  |  Page 89  |  Page 90  |  Page 91  |  Page 92  |  Page 93  |  Page 94  |  Page 95  |  Page 96  |  Page 97  |  Page 98  |  Page 99  |  Page 100