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September, 2021 High-Speed Flexible Cables from Yamaichi
SAN JOSE, CA — Conventional technologies such as flexible flat cables and flexible print- ed circuits (FFC/FPC) or micro-coaxial cables cannot cope with requirements for extremely high reliability and continuously increasing data transmission rates between internal printed circuit boards. Yamaichi Electronics has launched its Y-
FLEX cable technology to help solve this prob- lem. With the Y-FLEX high-speed FPC users can establish data rates of 56 Gb/s (PAM4) over a cable length of 3.9 in. (100 mm). The suitability of the Y-FLEX cable for
high data transmission rates is realized with characteristics such as LCP (liquid crystal polymer) as a base material, the contacting of
Y-FLEX high-speed flexible board-to-board cable.
various layers with so-called silver bumps and the special, 100 percent reproducible production process. In order to achieve par-
ticularly high transmission speeds, it is important to match the Y-FLEX specifically to the appropriate FFC/FPC connector. In principle, the Y-FLEX mating face can be adapted to any standard ZIF, non-ZIF or LIF connector. However, specially devel- oped highspeed ZIF or non-ZIF connectors such as the HF507 series from Yamaichi are designed to achieve the best performance. The biggest difference between Y-FLEX
and standard FPCs lies in the insulation material. Compared with the standard poly- imides used in conventional FPCs, the LCP insulation material in the Y-FLEX exhibits a much lower dielectric constant and a much lower dissipation factor at high frequencies. As a result, attenuation is much lower, and the data transmission rates are much higher than in standard FPCs. Also, LCP has superior hygroscopic properties compared with those of standard polyimide. Contact: Yamaichi
Electronics USA, 475 Holger Way, San Jose, CA 95134 % 408-715-9100 E-mail:
info@yeu.com Web:
www.yeu.com
INTERNATIONAL SYMPOSIUM on MICROELECTRONICS OCTOBER 11-14, 2021 • SAN DIEGO, CA •
IMAPS2021.org
54th Conference:
October 12 - 14, 2021 Exhibition:
October 12 - 13, 2021
Professional Development Courses: October 11, 2021
SPONSOR & EXHIBIT SALES UNDERWAY!
PREMIER SPONSOR
Highest-exposure sponsorship package Includes a booth and exceponal visibility
TECH SPONSOR
Bundles high visibility event sponsorships with a booth and addional exposure
NETWORKING SPONSOR
Sole or co-sponsorship of a funcon Booth not included
SUPPORTING VIRTUAL PARTNER Sponsorship for those companies
unable to parcipate in-person at the Symposium
For sponsorship information, contact
Brian Schieman, Executive Director
bschieman@imaps.org
IMAPS is consulting government agencies, event partners, and our stakeholders regarding the Covid-19 virus ahead of IMAPS 2021 San Diego. We will keep attendees informed of any effects to the event. IMAPS remains committed to delivering the best Symposium this Fall and anticipates a robust, healthy event for all of our attendees, speakers, and exhibitors. We are exploring all options for alternative conference plans including virtual presentation options and other online tools in the event that the in-person components of the Symposium are deemed unsafe or not possible and will be prepared to offer all in-person, virtual and/or blended meeting options for all.
The 54th International Symposium on Microelectronics, organized by the International Microelectronics Assembly and Packaging Society (IMAPS), will feature 5 technical tracks, plus an Interactive Poster Session that span the three days of sessions. Emphasis is on packaging technologies that serve 5G, High Performance Computations, Automotive, Industrial, Defense/Space, and Medical electronics markets.
• TRACK 1: Manufacturing Optimization
• TRACK 2: Wafer Level/Panel Level (Advanced RDL)
• TRACK 3: High Performance/High Reliability
• TRACK 4: Advanced Package (Flip Chip, 2.5D, 3D, Optical)
• TRACK 5: Advanced Process & Materials (Enabling Tech.) ROHM
IGBTs SANTA CLARA, CA — ROHM Semiconductor today announced its RGWxx65C series of hybrid IGBTs with an integrated 650V SiC Schottky barrier diode. The devices, qualified under
the AEC-Q101 automotive relia- bility standard, are ideal for automotive and industrial appli- cations that handle high power, such as photovoltaic power con- ditioners, onboard chargers, and DC/DC converters used in elec- tric and electrified vehicles (xEVs). The RGWxx65C series
(RGW60TS65CHR, RGW80T S6 5 - CHR, RGW00TS65CHR) utilizes ROHM’s low-loss SiC Schottky barrier diodes in the IGBT feed- back block as a freewheeling diode that has almost no recovery energy, thus minimal diode switching loss. Additionally, since the recovery current does not have to be handled by the IGBT in turn-on mode, IGBT turn-on loss is significantly reduced. Both effects together result
in up to 67 percent lower loss over conventional IGBTs and 24 percent lower loss compared with super junction MOSFETs (SJ MOSFETs) when used in vehicle chargers. Contact: ROHM Semicon -
ductor USA, 2323 Owen Street, Santa Clara, CA 95054 % 408-720-1900 E-mail:
jpontious@rohmsemiconductor.com Web:
www.rohmsemiconductor.com
Introduces Hybrid
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