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www.us-tech.com
September, 2021 ELECTRONIC MFG PRODUCTS
Fuji Offers NXT III Pick-and-Place System
VERNON HILLS, IL — Fuji Corporation’s NXT series pick-and-place systems continue to be a well-regarded and top-selling plat- form. Recently, the company shipped its 100,000th system.
NXT III supports the smallest parts being used in mass production with extreme plac- ing accuracy. As well as supporting the smallest parts
currently being used in mass production the NXT III can also handle the next gen- eration of components headed for the market. By improving machine rigidity
and further refining its independent servo control and vision recognition technology, Fuji has achieved excellent placing accuracy for small chips. The GUI of the original NXT was
widely praised for making use of intu- itive and easy-to-understand pic- tograms instead of relying on lan- guage-based instructions. This interface is now combined
Fuji NXT III scalable pick-and-place system.
The new NXT III is a highly productive,
multifunctional modular placing machine. Built for speed, it features a faster x/y robot and tape feeders, as well as a new H24 head that achieves 35,000 chips per hour. The
with a touchscreen panel to make oper- ation even easier. This reduces the number of buttons required for select- ing commands, as well as improving quality by reducing the chance of per- forming the wrong command. Contact: Fuji America Corp., 171 Corpo-
rate Woods Parkway, Vernon Hills, IL 60061 % 847-821-2459 E-mail:
christinep@fujiamerica.com Web:
www.fujiamerica.com
Technica Offers EMC’s Low-Loss Laminate
Materials SAN JOSE, CA — The insatiable need for Ethernet speed and wider bandwidth has es- calated the demands for extreme low-loss laminate materials. EMC has developed its EM892K and EM892K2 materials to meet the needs of next-gen 800GE switch and router, HPC, 5G, and AI applications. These advanced laminate materials
have been designed not only with exceptional electrical performance but also successfully passed the most stringent reliability stan- dards. In addition, they are formulated to be ca-
pable of withstanding sequential lamination design up to 7X lamination cycles and are fully compatible with hybrid PCB design with the company’s recommended EM-370(Z) mid-loss material for cost reduction. To en- able extra SI buffer for SI critical projects, EMC has also developed both HVLP3 and HVLP4 foils to further push the limits of per- formance.
Contact: Technica U.S.A., 2431 Zanker
Road, San Jose, CA 95131 % 408-240-5950 E-mail:
sales@technica.com Web:
www.technica.com
With our extensive inventory of standard building blocks, EXATRON can easily customize equipment for nearly any application.
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