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www.us-tech.com


September, 2021


Laser Selective Soldering Enables Next-Gen Electronics


By Brian Sohn, VP Business Development, Laserssel A


leading provider of laser selective soldering technol- ogy supporting global


semiconductor, automotive, con- sumer, communications, military and industrial segments, Lasers- sel Co., Ltd., is a pioneer in selec- tive soldering. The company offers laser se-


lective reflow (LSR), which en- ables soldering to heat-sensitive substrates that are impossible to reflow by conventional means. Since being founded in 2015, Laserssel has expanded its prod- uct offerings across the board and offers advanced packaging, plastic and organic substrates, very thin substrates at risk of warpage and any other chal- lenges.


Combined with its extensive


knowledge in laser technology and expertise in process technol- ogy, Laserssel is well positioned to help customers solve problems in the space of packaging and as- sembling the next generation of electronic devices. With R&D be- ginning almost 12 years ago, the company has come a long way.


Dedicated Ti tanium Selective Solder Nozzle Machining Services


Laserssel’s beam shaper projects square lasers with 5µ accuracy.


sored project “Development of Non-Conductive Film (NCF) for Stated Package of TSV 3D IC” and developed laser selective re- flow (LSR) with a 2 x 2 in. (50 x 50 mm) laser beam. 2018 was a pivotal year as


tors.” Also that year, the company completed the MP version of in- line compression LSR(LCB) and launched the Laserssel brand. Today, a large number of


mini-LED laser rework systems have been adopted by customers,


Adjustable SMT Full Process Carrier


Brief Background In 2015, it founded Crucial-


Machines, became a registered technology laboratory, partici- pated in the government-spon-


the company was selected for the GlobalStar venture program “De- velopment of Multi Beam Large Area Laser Reflow System for High Efficiency Production of Ad- vanced Flip Chip Semiconduc-


proving that LSR is a mainstay for Laserssel.


Laser Beam Control The company is able to proj-


ect a uniform defocused laser beam over a specifically tailored area. The secret ingredient is the company’s beam shaping optic module (BSOM). This device en- ables selective application of en- ergy to locations that require sol- dering while not heating up po- tential thermally-sensitive ar- eas.


LSR is also, potentially, a


means to mitigate or even elimi- nate the warpage of various packages. It provides an ex- tremely reliable bonding process in record speeds of less than 3 seconds. The system takes only a few


seconds to ramp up, with a rate of 117°F (65°C) per second, re- quires no elongation of the PCB, takes up less floor space, and saves energy because it doesn’t need to purge nitrogen. LSR only heats areas where Continued on next page


Manual Slide Line (Combo-Slide)


Wet ted Selective Solder Nozzles


PCB Assembly and Handling Solutions


Custom Selective Solder Fixture


Assembly Fixture (Fl ip-Rak)


1 Gwinnup Road • Blairstown, NJ 07825 Phone: 908.362.5588 • Fax: 908.362.5115 cs@mb-mfg.com • WWW.MB-MFG.COM


Adjustable Wave Solder Fixture


Titanium Finger Masks Board Stiffeners


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