September, 2021
www.us-tech.com
Page 47 Henkel Expands Dual-Cure Adhesive Portfolio
IRVINE, CA — Tackling the reliability and data rate demands of 100 gigabit ethernet (GbE) and 400 GbE optical transceivers in next-generation cloud and hyperscale data centers, Henkel has developed LOCTITE® STYCAST® OS 5101, a dual-cure adhesive for optimal, precise optical lens and compo- nent alignment during the inline assembly process. The new material builds on the compa-
ny’s growing portfolio of data center optics products and has been designed to provide excellent alignment accuracy for maximum light transmission in high-speed optical transport network solutions. In order for optical signals to transmit
with minimal loss, meticulous alignment of lenses and optical components is required. After a first stage UV partial cure, LOC- TITE STYCAST OS 5101 allows precise positioning of optical lenses within the transceiver op- tical sub-assembly and, once final thermal curing takes place, the material maintains its di-
TANAKA Develops Composite Heatsink Material
MILLEDGEVILLE, GA — TANAKA has developed an ac- tive brazing filler metal/copper composite material for power de- vices that can reduce processing times. The new material will contribute to heat dissipation when used in next-generation heatsinks for power devices. TANAKA products are available in North America from TopLine Corporation. The new product is a com-
posite (cladding) of copper mate- rial with active brazing filler metal on one side. Since it can be joined directly to any material including ceramics (oxides, ni- trides, and carbides) and carbon materials, it is expected that it will be used in ceramic sub- strates and next-generation heatsinks for power devices. Benefits include high heat
dissipation, labor savings, im- proved performance, and cost re- duction. The copper is com- pounded, which means that a pattern can be formed simply by setting the material. Also, since the material contains no sol- vents, VOCs are not released. Overall brazing time can be
greatly reduced, leading to ener- gy savings and redudcing envi- ronmental impact. Contact: TopLine Corp., 95
Highway 22 W, Milledgeville, GA 31061 % 800-776-9888 E-mail:
sales@topline.tv Web:
www.topline.tv
shown: PulseForge Soldering Batch also available in PulseForge Soldering In-Line
mensional stability to ensure accurate lens position while in operation.
In addition to high reliability as con-
firmed by high temperature/high humidity, thermal shock and high temperature storage testing, internal results also indicate that material properties of LOCTITE STYCAST OS 5101 are capable of delivering other im- portant performance metrics for 100 to 400 GbE transceiver optical bonding, such as maximized optical signal through positional integrity and dimensional stability and a low coefficient of thermal expansion (CTE). Contact: Henkel Corp., 14000 Jamboree
Road, Irvine, CA 92606 % 714-780-2909 E-mail:
eva.laus@
henkel.com Web:
www.henkel.com
LOCTITE® STYCAST® OS 5101 adhesive. See at the Battery Show, Booth 1411
PulseForge® The Future of Soldering
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