Page 44
www.us-tech.com
September, 2021
New Silicones for EVs from Dow Chemical
MIDLAND, MI — Dow has launched new DOWSIL™ prod- ucts, designed to offer excellent thermal conductivity, easy pro- cessing and controlled volatility for demanding automotive elec- tronics applications. The company has intro-
duced three new silicone tech- nologies for electric and hybrid- electric vehicle electronics appli- cations. These innovative new products increase the value and versatility of Dow’s silicones portfolio to meet the evolving needs of automotive electrifica- tion.
Advanced features of these
DOWSIL products include reli- able performance, high thermal conductivity, controlled volatility for very efficient heat dissipa- tion, and easy processing for en- hanced productivity. DOWSIL TC-2035 CV Adhe-
sive delivers high thermal con- ductivity, a fast cure and long room temperature shelf-life sta- bility for the assembly of auto- motive electronics, including ad- vanced driver assistance systems (ADAS) units and electronic con- trol units (ECUs). DOWSIL TC-4551 CV gap
DL Technology has been the leader in micro dispensing technology for over 15 years. For more
www.dltechnology.com 216 River Street, Haverhill, MA 01832 • P: 978.374.6451 • F: 978.372.4889 •
sales@dltechnology.com
filler also provides high thermal conductivity and reliable per- formance in automotive power electronics, ECUs and ADAS. The new adhesive and gap filler feature controlled volatility, which not only supports sustain- ability and regulatory compli- ance, but also helps to avoid elec- trical contact failure that can occur due to the evaporation of volatiles. The third new product,
DOWSIL™ TC-4060 GB250 thermal gel, provides the highest thermal conductivity of the new products. The heat dissipation capa-
bility of this material, combined with very good dispensing prop- erties, makes it an excellent can- didate for applications such as converters, inverters and on- board chargers for battery packs. This soft thermal gel also sup- plies stress relief and shock damping and performs reliably under high power and high tem- peratures.
Contact: The Dow Chemical
Company, 2211 H.H. Dow Way, Midland, MI 48674 % 989-636-1000 Web:
www.dow.com
Circuit Technology Adds Two Robotic Hot Solder Dip (RHSD) Systems
HAVERHILL, MA — Circuit Technology Center has issued a purchase order to RPS/Hentec
for two additional Odyssey 1325 robotic hot solder dip (RHSD) machines. The Odyssey 1325 is a MIL
THE DISPLAY EXPERTS
Our experience, industry expertise and market knowledge across all areas of display technology make us the perfect partner for professional display solutions. With our extensive portfolio of all leading manufacturers and a wide range of customisation options, we can efficiently meet almost any customer requirement.
For more information please visit
www.data-modul.com
LEADING DISPLAY TECHNOLOGY PARTNER
IN-HOUSE OPTICAL BONDING
IN-HOUSE EMBEDDED DEVELOPMENT
IN-HOUSE DESIGN & MANUFACTURING
DATA MODUL Inc. US Headquarters | 275 Marcus Blvd. | Hauppauge, NY 11788 |
info.us@
data-modul.com |
www.data-modul.com
spec compliant, high-volume, high-mix component lead-tin- ning machine equipped with au- tomatic load and unload and is capable of processing dual solder alloys. The equipment complies
with all applicable GEIA-STD- 006, J-STD-001 and IEC TS 62647-4 standards. This purchase will double
the existing capacity of Circuit Technology Center’s component level modification services de- partment to meet the increasing demand from the defense and high reliability customer base that require component level modification. This state-of-the-art equip-
ment is also used for automated, touch-less BGA component de- balling, required as part of con- verting BGA’s with lead-free sol- der to tin-lead solder. Contact: Circuit Technology
Center, Inc., 22 Parkridge Road, Haverhill, MA 01835 % 978-478-5103 E-mail:
blepage@circuitrework.com Web:
www.circuitrework.com
Page 1 |
Page 2 |
Page 3 |
Page 4 |
Page 5 |
Page 6 |
Page 7 |
Page 8 |
Page 9 |
Page 10 |
Page 11 |
Page 12 |
Page 13 |
Page 14 |
Page 15 |
Page 16 |
Page 17 |
Page 18 |
Page 19 |
Page 20 |
Page 21 |
Page 22 |
Page 23 |
Page 24 |
Page 25 |
Page 26 |
Page 27 |
Page 28 |
Page 29 |
Page 30 |
Page 31 |
Page 32 |
Page 33 |
Page 34 |
Page 35 |
Page 36 |
Page 37 |
Page 38 |
Page 39 |
Page 40 |
Page 41 |
Page 42 |
Page 43 |
Page 44 |
Page 45 |
Page 46 |
Page 47 |
Page 48 |
Page 49 |
Page 50 |
Page 51 |
Page 52 |
Page 53 |
Page 54 |
Page 55 |
Page 56 |
Page 57 |
Page 58 |
Page 59 |
Page 60 |
Page 61 |
Page 62 |
Page 63 |
Page 64 |
Page 65 |
Page 66 |
Page 67 |
Page 68 |
Page 69 |
Page 70 |
Page 71 |
Page 72 |
Page 73 |
Page 74 |
Page 75 |
Page 76 |
Page 77 |
Page 78 |
Page 79 |
Page 80 |
Page 81 |
Page 82 |
Page 83 |
Page 84 |
Page 85 |
Page 86 |
Page 87 |
Page 88 |
Page 89 |
Page 90 |
Page 91 |
Page 92 |
Page 93 |
Page 94 |
Page 95 |
Page 96 |
Page 97 |
Page 98 |
Page 99 |
Page 100
