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Page 72


www.us-tech.com


September, 2021


New Form-in-Place Thermal Gap Filler from Fujipoly


CARTERET, NJ — SARCON® SPG-25B-NS from Fujipoly® is an easy to dispense, low-viscosi- ty, silicone free compound that exhibits a thermal conductivity of 2.5 W/m-K and a thermal


not cause corrosion on metal sur- faces, and maintains all initial properties across a wide temper- ature range. This makes SPG- 25B-NS an ideal thermal solu- tion for the development of


Silicone-free gap filler.


resistance of only 2.1 K-cm2/W. When applied between heat-gen- erating components and a nearby heat sink or spreader, the form stable thermal material com- pletely fills delicate gaps as small as 0.02 in. (0.5 mm). This allows for more effi-


cient transfer and dissipation of heat from the component and improved performance. SPG- 25B-NSA has excellent vibration absorption capabilities and requires no heat curing. It will


smaller electronic devices and higher frequencies. Customers can order this product in 30cc syringes or 325cc cartridges. Custom packaging is also avail- able upon request. Contact: Fujipoly America


Corp., 900 Milik Street, Carteret, NJ 07008 % 732-969-0100 E-mail: fhobler@fujipoly.com Web: www.fujipoly.com


See at the Battery Show, Booth 822


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