September, 2021
www.us-tech.com
Verifying Solder Paste with X-Ray Inspection Is the voiding percentage within the re-
Continued from previous page Cobar produces SAC305 in particle sizes
ranging from T3 to T5 — the higher the par- ticle number, the smaller the particle size. The finer the pitch of the components being assembled, the higher the particle number required. The alloy may be lead-free, as mandated
within the E.U. since 2005, or the traditional tin-lead combination still used in some North and South American applications. The flux may be water-soluble or no-clean rosin based, which is the most used variety. Even with all these different combina-
tions, other pastes may be required for spe- cific applications. Mathijssen recalls one cus-
tomer who experienced tombston- ing — where one end of a compo- nent rises up rather than remain- ing horizontal in the solder paste — when using SAC305 in a vapor phase reflow process. Cobar sup- port specialists, who are IPC-600 and IPC-610 certified, reviewed the situation and recommended switching to SCAN-Ge071 from the company’s JEAN-151 range. The new SCAN-Ge071 alloy
solved the tombstoning problem in two ways: its narrow melting range of 16.2°F (9°C) prevented one side of the component from lifting before the other side was completely melted, and its rela- tively low flux content reduced pollution of the heating medium Galden 230. Perhaps the greatest benefit of the JEAN-151 line is that it is available in multiple al- loys, rather than in three or four variations.
Under Development “We are producing eight dif-
ferent alloys now,” Mathijssen says. Once an end user specifies the JEAN-151 flux, Mathijssen notes, “the assembler has access to multiple alloys, each with their own application area.” This is important for auto-
motive and medical applications in particular, since end users of- ten specify certain alloys. As a re- sult, according to Mathijssen, the JEAN-151 line has become an all- around product suitable for many applications. Another new paste from Co-
bar is its LMPA (low melting point alloys) line, which has a peak temperature of 428°F (220°C), as opposed to 464°F (240°C) for conventional solder pastes. In Cobar’s LMPA the al- loy is reinforced, making the sol- der joint much stronger. Interest in LMPAs is grow-
ing in response to the needs of LED manufacturers. Intel is the main driver of this trend.
Revealing Defects with X-Ray
The process of creating any
new solder paste starts in the re- search department, performance must be verified through trial and error. To evaluate a new sol- der paste, Cobar relies on real- time X-ray inspection.
ERP / MES Proactive replenishment Process control
quired specification? Are any solder balls trapped under a tiny LED component? Or is there a condition known as head-in-pillow (HiP), where one corner of the BGA compo- nent is higher than the others and so does not make solid contact with the underlying pad? This last flaw is particularly challenging
since it is not obvious in post-reflow visual in- spection.
Mathijssen explains that X-ray is an es-
sential tool in the development of solder paste and cites Glenbrook Technologies’ Jew- el Box 70T X-ray inspection system in partic- ular. Some benefits from using the machine include a large door and X-ray inspection
Page 19
area with a small overall footprint. The Jewel Box also allows the user to ro-
tate and tilt the board being inspected, a valuable feature for issues such as HiP, which cannot be seen from above. Both the hardware and the GTI-5000 software in- stalled on the Jewel Box are easy to use, Mathijssen adds. For now, Cobar’s ongoing product development program will continue to rely on the Jewel Box, as the company con- tinues to shrink the size of its particles for cutting-edge semiconductor applications. Contact: Glenbrook Technologies, 11
Emery Avenue, Randolph, NJ 07869 % 973- 361-8866 E-mail:
szweig@glenbrooktech.com Web:
www.glenbrooktech.com r
Meet us at
booth A3.342 at Productronica 2021
Line automation Jet Printing SPI Pick-and-Place 3D AOI Component Storage
Meet the new MYPro Line™ The future just got smarter. With the MYPro Line, you can jet print perfect solder joints at the highest speeds. Ensure non-stop production with intelligent storage and proactive replenishment. And eliminate defects with 3D inspection systems that monitor and improve your process over time. It’s the best of Mycronic in a single integrated manufacturing solution. Now with more intuitive process controls, Hermes support and new dashboard and analysis software to simplify production scheduling and improve line effi ciency. All to put the future back where it belongs: in your control.
Connectivity
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