search.noResults

search.searching

saml.title
dataCollection.invalidEmail
note.createNoteMessage

search.noResults

search.searching

orderForm.title

orderForm.productCode
orderForm.description
orderForm.quantity
orderForm.itemPrice
orderForm.price
orderForm.totalPrice
orderForm.deliveryDetails.billingAddress
orderForm.deliveryDetails.deliveryAddress
orderForm.noItems
September, 2021


www.us-tech.com Continued from previous page


soldering takes place, resulting in minimal damage to sub- strates. Other benefits include fast tact time and BSOM beam uniformity. For fine-pitch applications,


it offers 40µ pitch solder bump and 30µ chip soldering, and has a shorter TAL than mass reflow. Also, cooling speed is directly re-


BARTLETT, IL — The HiS VARIO B 35 is the latest product from Herrmann Ultrasonics for small, delicate metal welding. Complementing the HiS VARIO B 20, this new 35 kHz version ex- pands the company’s capabilities in metal welding. The new system offers


Herrmann Launches Modular Metal Welder


quick-change tooling that can be changed from the top or the front of the machine. The HiS VARIO B 35 is ideally suited for cylindri- cal cell welding as well as other lithium-ion batteries applica- tions that utilize with extremely thin foils or a low foil count. Pre- cise force control is essential for these applications. With a range of 5 to 260 N


even the most demanding applica- tions are no match for the HiS VARIO B 35. The sequential drive concept is also unique. A compo- nent of the drive concept is its patented jig system that ultimate- ly ensures precise force control. The machine is designed to


be both modular and flexible. The HiS VARIO B 35 can either be configured as a manual sys- tem, operated with palm but- tons, a component for automa- tion, incorporated with PLC con- trol or fieldbus. At only 69 mm (2.7 in.) wide,


multiple systems can be packed tightly together saving precious space. The HMI touchscreen in- terface is intuitive and informa- tive. Graph ing functions display weld force, distance and power as an easy way to visualize the weld process. The HiS VARIO B 35 can store 32 different weld programs, offering flexibility for quick prod- uct changeovers. Weld graphs and data are stored internally and can be downloaded. Contact: Herrmann Ultra-


sonics, 1261 Hardt Circle, Bartlett, IL 60103 % 630-626-1626 E-mail: info@herrmannultrasonics.com Web: www.herrmannultrasonics.com


See at The Battery Show, Booth 1932





lated to the formation of multi- grain as well as uniform, thin formation of intermetallic com- pounds, resulting in greater shear strength. Recently LSR was selected


for high-end GPU mass produc- tion by a top-tier consumer elec- tronics manufacturer, due to its elimination of substrate war - page.


An additional advantage to


heating only a selected laser re- gion is that when the area laser is applied to chips, only those chips are being heated to target- ed reflow temperature. Regions immediately outside of the laser


beam area show dramatically lower temperature on an in- frared camera image.


LSR Product Range Laserssel’s LSR technology


is available in five innovative models. The LSR1000 has a bonding accuracy of 5µ and a sin- gle-laser 1 kW head, and a vari- able or fixed beam, square or rec- tangular, shape. The LCB series is higher-powered version, with a 3 kW single-laser head. This sys- tem also includes monitoring and a beam profiler, as well as a real- time power meter. The company also offers its


Page 23 Laser Selective Soldering Enables Next-Gen Electronics


pLSR and rLSR systems, which are 100 and 400 kW models re- spectively aimed at rework appli- cations.


With applications in mini-


and microLED displays, semi- conductors, wearables, and EVs, Laserssel’s innovative laser sol- dering technology meets a broad range of needs across multiple markets.


Contact: Laserssel Co., Ltd.,


20, 79 beon-gil, Hoseo-ro, Bae- bang-eup, Asan, Chungcheong- namdo, Korea % +82-31-8060-3075 E-mail: brian@laserssel.com Web: www.laserssel.com r


 


 


  


   


 





Page 1  |  Page 2  |  Page 3  |  Page 4  |  Page 5  |  Page 6  |  Page 7  |  Page 8  |  Page 9  |  Page 10  |  Page 11  |  Page 12  |  Page 13  |  Page 14  |  Page 15  |  Page 16  |  Page 17  |  Page 18  |  Page 19  |  Page 20  |  Page 21  |  Page 22  |  Page 23  |  Page 24  |  Page 25  |  Page 26  |  Page 27  |  Page 28  |  Page 29  |  Page 30  |  Page 31  |  Page 32  |  Page 33  |  Page 34  |  Page 35  |  Page 36  |  Page 37  |  Page 38  |  Page 39  |  Page 40  |  Page 41  |  Page 42  |  Page 43  |  Page 44  |  Page 45  |  Page 46  |  Page 47  |  Page 48  |  Page 49  |  Page 50  |  Page 51  |  Page 52  |  Page 53  |  Page 54  |  Page 55  |  Page 56  |  Page 57  |  Page 58  |  Page 59  |  Page 60  |  Page 61  |  Page 62  |  Page 63  |  Page 64  |  Page 65  |  Page 66  |  Page 67  |  Page 68  |  Page 69  |  Page 70  |  Page 71  |  Page 72  |  Page 73  |  Page 74  |  Page 75  |  Page 76  |  Page 77  |  Page 78  |  Page 79  |  Page 80  |  Page 81  |  Page 82  |  Page 83  |  Page 84  |  Page 85  |  Page 86  |  Page 87  |  Page 88  |  Page 89  |  Page 90  |  Page 91  |  Page 92  |  Page 93  |  Page 94  |  Page 95  |  Page 96  |  Page 97  |  Page 98  |  Page 99  |  Page 100