September, 2021
www.us-tech.com Continued from previous page
soldering takes place, resulting in minimal damage to sub- strates. Other benefits include fast tact time and BSOM beam uniformity. For fine-pitch applications,
it offers 40µ pitch solder bump and 30µ chip soldering, and has a shorter TAL than mass reflow. Also, cooling speed is directly re-
BARTLETT, IL — The HiS VARIO B 35 is the latest product from Herrmann Ultrasonics for small, delicate metal welding. Complementing the HiS VARIO B 20, this new 35 kHz version ex- pands the company’s capabilities in metal welding. The new system offers
Herrmann Launches Modular Metal Welder
quick-change tooling that can be changed from the top or the front of the machine. The HiS VARIO B 35 is ideally suited for cylindri- cal cell welding as well as other lithium-ion batteries applica- tions that utilize with extremely thin foils or a low foil count. Pre- cise force control is essential for these applications. With a range of 5 to 260 N
even the most demanding applica- tions are no match for the HiS VARIO B 35. The sequential drive concept is also unique. A compo- nent of the drive concept is its patented jig system that ultimate- ly ensures precise force control. The machine is designed to
be both modular and flexible. The HiS VARIO B 35 can either be configured as a manual sys- tem, operated with palm but- tons, a component for automa- tion, incorporated with PLC con- trol or fieldbus. At only 69 mm (2.7 in.) wide,
multiple systems can be packed tightly together saving precious space. The HMI touchscreen in- terface is intuitive and informa- tive. Graph ing functions display weld force, distance and power as an easy way to visualize the weld process. The HiS VARIO B 35 can store 32 different weld programs, offering flexibility for quick prod- uct changeovers. Weld graphs and data are stored internally and can be downloaded. Contact: Herrmann Ultra-
sonics, 1261 Hardt Circle, Bartlett, IL 60103 % 630-626-1626 E-mail:
info@herrmannultrasonics.com Web:
www.herrmannultrasonics.com
See at The Battery Show, Booth 1932
lated to the formation of multi- grain as well as uniform, thin formation of intermetallic com- pounds, resulting in greater shear strength. Recently LSR was selected
for high-end GPU mass produc- tion by a top-tier consumer elec- tronics manufacturer, due to its elimination of substrate war - page.
An additional advantage to
heating only a selected laser re- gion is that when the area laser is applied to chips, only those chips are being heated to target- ed reflow temperature. Regions immediately outside of the laser
beam area show dramatically lower temperature on an in- frared camera image.
LSR Product Range Laserssel’s LSR technology
is available in five innovative models. The LSR1000 has a bonding accuracy of 5µ and a sin- gle-laser 1 kW head, and a vari- able or fixed beam, square or rec- tangular, shape. The LCB series is higher-powered version, with a 3 kW single-laser head. This sys- tem also includes monitoring and a beam profiler, as well as a real- time power meter. The company also offers its
Page 23 Laser Selective Soldering Enables Next-Gen Electronics
pLSR and rLSR systems, which are 100 and 400 kW models re- spectively aimed at rework appli- cations.
With applications in mini-
and microLED displays, semi- conductors, wearables, and EVs, Laserssel’s innovative laser sol- dering technology meets a broad range of needs across multiple markets.
Contact: Laserssel Co., Ltd.,
20, 79 beon-gil, Hoseo-ro, Bae- bang-eup, Asan, Chungcheong- namdo, Korea % +82-31-8060-3075 E-mail:
brian@laserssel.com Web:
www.laserssel.com r
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