May, 2020


www.us- tech.com Inline Robotic Soldering... Continued from previous page


safe. This workaround is fraught with problems because it actually makes the root cause worse. If heavy copper requires more exposure to the copper-dissolving wave, then deliber- ately making the copper heavier increases exposure to the copper-dis- solving wave. This paradoxical situa- tion makes finding an ideal pre-sol- der thickness very difficult or impos- sible.


If an ideal thickness can be


found, several additional problems immediately spring up. The solder alloy is constantly increasing its cop- per content. Increasing the copper in the alloy changes the process and this requires constant product test- ing to verify the copper has not become dangerously thin. Even if everything is sorted out, this approach wastes copper, and these joints require a very long time to sol- der using a wave.


Iron Complements Mini-Wave As a general rule, the mini-


wave can be faster at soldering “nor- mal” joints, because the molten sol- der heats and wets the joints in one step as the fountain is dragged over multiple joints. The selective mini-


Inspection, Metrology....


Continued from page 69


nants in the gas and vacuum lines of semiconductor process equipment. The ability to monitor particles in- line is particularly relevant for EUV lithography tools, because particle detection can significantly improve customers’ yield, tool uptime and productivity. There are approximately 100


EUV tools worldwide and that num- ber is growing by about 15 percent each year. Most of the tools are in three


fabs. CyberOptics’ opportunity is to have its IPS sensor in multiple pumping lines on the EUV tool and measure the particles, so that the process engineer can tell when parti- cle concentration is increasing. This could indicate that the col-


lector efficiency might be in jeopardy and signal to perform a gas purge or flush. Today, that information is not readily available and the engineer has to make a guess, shut down the tool, and do the purge. They may eas- ily be either overdoing it, or underdo- ing it, both of which can be a major problem in terms of yield and produc- tivity.


Cloud computing, 5G and artifi-


cial intelligence (AI) are a few of the key market drivers that will enable future growth in SMT, semiconduc- tor and the converging market of advanced packaging. CyberOptics is poised for growth in the coming years with its proprietary technology plat- forms and commitment to innova- tion. The company aims to stay ahead of customers’ needs and deliv- er significant benefits. Contact: CyberOptics, Corp.,


5900 Golden Hills Drive, Minneapolis, MN 55416 % 952-820-5837 E-mail: cfuranna@cyberoptics.com Web: www.cyberoptics.com r


wave is an effective technology, as long as all the solder joints are rela- tively small and are similar in mass. However, the iron is normally


faster than the mini-wave with high- mass joints. Selective mini-waves need to keep the molten solder tem- peratures as cool as possible to mini- mize copper dissolution. Even in extreme cases, the solder wave must be kept under 536°F (280°C). In con- trast, irons commonly operate at 716°F (380°C) and can operate over 932°F (500°C) if needed. By increas- ing the temperature of the heat source, the time needed to preheat the joint to reflow temperature decreases dramatically. When it


comes to high-mass joints, the solder- ing iron not only provides a feasible inline solution, it is usually faster. Each technology has its own


advantages, and mta anticipates that the MPS700 will be a complement to selective mini-wave soldering —not a replacement for it. It should be noted that, if a production line has both a selective mini-wave and an MPS700, the temperature of the mini-wave can be lowered for normal joints while the MPS700 processes the high-mass joints. This means having an MPS700 in the production line also improves the quality of joints soldered with the mini-wave by allowing it to operate at its ideal tem-


perature. The occurrence of high-mass


joints is a growing trend. As compo- nents become smaller, they require more amperage to provide the same output. Copper must be thicker to safely carry more amperage. So, as long as consumers want smaller devices, we can expect boards to have more joints with large pins, thick copper, or multiple layers of copper. The MPS700 is a solution to each of these present problems. Contact: mta automation, inc.,


50-1 River Street, Old Saybrook, CT 06476 % 860-399-1141 E-mail: info@mtaautomation.com Web: www.mtaautomation.com r


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