May, 2020
www.us-
tech.com
Page 35
SEHO’s Plasma Fluxer an Alternative to Alcohol-Based Flux
Erlanger, KY — SEHO is now offering a solvent- free alternative to conventional alcohol-based flux- es, the SEHO PlasmaFluxer. In a plasma process, flux powder is deposited at the solder joints with excellent adherence and long-term stability. Prod- uct quality can also be dramatically improved. The activation of components and the PCB
surface is the key factor to obtain a connection be- tween the solder and the terminations. This task is taken over by the flux, which in wave soldering processes is often alcohol-based and contains only a small amount of active components that indeed are necessary for the process. Alcohol is only needed for the application of
the flux and needs to be dried off before entering the solder wave. Flux residues are still an issue, particularly due to the increasingly extreme operating condi- tions to which electronic assemblies are exposed. The PlasmaFluxer from SEHO
uses cold-active plasma to melt mi- crometer-sized powder of pure adipic acid and deposit it on the PCB sur- face. A liquid carrier material is not needed, and the gas that is used to create the plasma flame is nitrogen, which is widely used in wave solder- ing technology. When processing as- semblies, an aerosol formed out of
Fujipoly Develops Thermal Interface Caps the manufacturing
Carteret, NJ — In an effort to streamline
process and improve transistor cool- ing, Fujipoly® is now offering a large assortment of box-shaped Sarcon® thermal interface caps. These cases are available in standard sizes to fit many transistors and can be cus- tomized to exact specifications. Installation takes only seconds,
as the caps can be slid over the heat- generating component. Once fitted, unwanted heat is dissipated to the surrounding environment or nearby heatsinks. Depending on the power and
cooling requirements of the applica- tion, case-shaped covers are offered
PlasmaFluxer, an alternative to liquid fluxes.
meltable flux particles and Nitrogen is led into the plasma flame and directed to the PCB surface. Once the aerosols touch the surface, the particles solidify and form a long-term stable coating. The plasma process substitutes the conven-
tional wet-chemical flux activation with a dry process. Soldering results that are achieved with this process are excellent and are directly compa- rable with liquid fluxes, even with complicated
structures. Contact: SEHO North America, Inc., 1445
Jamike Avenue, Suite 1, Erlanger, KY 41018 % 859-371-7346 fax: 859-282-6718
E-mail:
sehona@sehona.com Web:
www.seho.de/en/north-america
Thermal interface transistor caps.
in multiple Sarcon formulations with thicknesses between 0.01 and 0.04 (0.3 and 0.9 mm). Thermal conduc- tivity properties range from 1.1 to 1.7 W/m-K with a corresponding thermal resistance of 0.4 to 1.5°C in.2/W. Each case-shaped cover provides ad- ditional benefits, including electrical insulation and vibration and impact
protection. Contact: Fujipoly America
Corp., 900 Milik Street, Carteret, NJ 07008 % 732-969-0100 E-mail:
fhobler@fujipoly.com Web:
www.fujipoly.com
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