Page 66
www.us-
tech.com
May, 2020
The Importance of Inspection and Metrology for Process Control in SMT and Semiconductor Manufacturing
By Dr. Subodh Kulkarni, President and CEO, CyberOptics® Corporation
“advanced packaging.” This convergence can be found right in our pockets. Most high-end electron- ics, including smartphones, are using stacked advanced packages — no longer requiring a conven- tional PCB. Advanced packaging is evolving rapidly with
T
a variety of different processes and types. The goal is to have more power and functionality in a small- er package. Stacking deals with extremely thin chips and the cost of failure can be very high, mak- ing inspection critically important.
Precise Inspection and Metrology Every bump or pillar is essentially the glue
between the stacks. Some of the critical parame- ters to be controlled in these processes include bump height, position, diameter, shape, and copla- narity. All are important for reliable connections, which leads to a significant and growing need for fast and accurate 3D inspection and metrology to improve yields and long-term reliability. Among the inspection challenges, wafer-level
and advanced packaging can create multiple spec- ular reflections between shiny surfaces that can cause inaccurate height measurements. An inspec- tion technology capable of effectively addressing this issue is vital. The industry not only needs high resolution and high accuracy, but 100 percent inspection at high speed, particularly in higher- risk markets, such as automotive applications. This is where CyberOptics’ strength is with
AUTOMATE YOUR LABEL PLACEMENT 30 CELEBRATING YEARS CCL Labels CAB Printer
Feeder
Industry-standard AXIUM feeders for any machine High-durability CCL (formerly Nortec) labels and masking materials Special laser-markable labels for real-time serialization CAB thermal transfer printers for 3x3mm and larger labels Single-source solution support by the Hover-Davis automation experts
For more information or to request a quote, email:
sales@hoverdavis.com
www.hoverdavis.com
RoHS
For wafer-level and advanced packaging inspection, CyberOptics has launched its NanoResolution MRS sensor technology.
unique method for 3D, non-contact, optical sensing that CyberOptics pioneered a few years ago, which is much faster and more accurate than other con- ventional technologies. MRS meticulously identi-
he lines between the semiconductor and SMT industries are becoming increasingly blurred. This convergence is now referred to as
its Multi-Reflection Suppression™ (MRS™) tech- nology and where the company’s focus has been and will continue to be in the future. This is a
fies and rejects multiple reflections caused by shiny and specular surfaces. The real secret sauce is made up of the algorithms. The company is very optimistic about its
NanoResolution MRS sensor for advanced packag- ing. The bumps, for example, are around 30 to 40 µm each, with about the same pitch. Measuring features this size accurately requires a 3 µm pixel resolution sensor. The company has not only devel- oped this higher resolution, but has added the capability to measure perfectly reflective, mirror- like surfaces, such as a silicon wafer. This is possi- ble, because the system can take care of specular angles as well. It can perform highly accurate 100 percent 2D and 3D inspection, measuring critical features down to 25 µm at 25, 11.8 in. (300 mm) wafers per hour — two to three times faster than alternate technologies.
Measuring Critical Parameters CyberOptics is fundamentally a sensor tech-
nology company focused on the semiconductor and SMT markets. Around half of its customers for its flagship SQ3000™ multifunction system for AOI, SPI and coordinate measurements (CMM) are using it for semiconductor applications, including advanced packaging — either the semiconductor fabs or OSATs. The systems have been widely used in SMT
applications and for other various challenging applications, particularly in the high-end segment. Because of the merging of the markets, it can be difficult to determine whether it is a semi or SMT
Continued on page 69
Page 1 |
Page 2 |
Page 3 |
Page 4 |
Page 5 |
Page 6 |
Page 7 |
Page 8 |
Page 9 |
Page 10 |
Page 11 |
Page 12 |
Page 13 |
Page 14 |
Page 15 |
Page 16 |
Page 17 |
Page 18 |
Page 19 |
Page 20 |
Page 21 |
Page 22 |
Page 23 |
Page 24 |
Page 25 |
Page 26 |
Page 27 |
Page 28 |
Page 29 |
Page 30 |
Page 31 |
Page 32 |
Page 33 |
Page 34 |
Page 35 |
Page 36 |
Page 37 |
Page 38 |
Page 39 |
Page 40 |
Page 41 |
Page 42 |
Page 43 |
Page 44 |
Page 45 |
Page 46 |
Page 47 |
Page 48 |
Page 49 |
Page 50 |
Page 51 |
Page 52 |
Page 53 |
Page 54 |
Page 55 |
Page 56 |
Page 57 |
Page 58 |
Page 59 |
Page 60 |
Page 61 |
Page 62 |
Page 63 |
Page 64 |
Page 65 |
Page 66 |
Page 67 |
Page 68 |
Page 69 |
Page 70 |
Page 71 |
Page 72 |
Page 73 |
Page 74 |
Page 75 |
Page 76 |
Page 77 |
Page 78 |
Page 79 |
Page 80 |
Page 81 |
Page 82 |
Page 83 |
Page 84 |
Page 85 |
Page 86 |
Page 87 |
Page 88 |
Page 89 |
Page 90 |
Page 91 |
Page 92 |
Page 93 |
Page 94 |
Page 95 |
Page 96